Electronics Forum: thread (Page 5957 of 7930)

Tombstone/ Poor welting

Electronics Forum | Mon Feb 18 03:40:04 EST 2008 | akareti

Hi everybody, I found a defect varistor 0603 Tombstone and poor welting when we use component that terminal is Silver palladium (Ag/ Pd) with Leaded solder paste (63/37). Then we change alternative component that terminal is Ni/ Sn the result not fou

Tombstone/ Poor welting

Electronics Forum | Wed Feb 20 09:07:19 EST 2008 | scottp

I've done some pretty scary cross-sections of chip sized coils with AgPd terminations with Pb free solder. The AgPd went into solution and there was essentially nothing left to solder to. We also had convex fillet shapes that clearly didn't meet wo

Tombstone/ Poor welting

Electronics Forum | Thu Feb 21 03:25:58 EST 2008 | jlawson

I have seen smt chip varistors with Pd/Ag teminations that had poor wetting in terms of good fillet in LF (sac305) soldering. We found that the solder tended to be attracted to the plating on the part and off the actual pad (silver Immersion). This c

no-clean flux vs. impedance

Electronics Forum | Tue Feb 19 08:49:34 EST 2008 | rgduval

Get the ionic specs from your flux manufacturer, and show it to the designer. No-clean flux/solder is supposed to be low to minimal in ionic contamination, which allow the whole no-clean thing. If he needs further proof, you can have the board io

no-clean flux vs. impedance

Electronics Forum | Tue Feb 19 09:26:54 EST 2008 | jdengler

The low solids flux that is commonly called no-clean can affect some circuits. We are building a PCB that measures pico amps. The customer required that it be cleaned. We would rather used the low solids and eliminate a step. The customer had

titanium pallets

Electronics Forum | Mon Feb 18 17:18:54 EST 2008 | slootj

Has anyone experienced problems with using Titanium pallets when they get hot? I have a product that solders with no defects when the Ti is first used or warm but then have leads that are not soldered when the pallet is hot. By hot I mean it has been

Dendrite growth

Electronics Forum | Wed Feb 20 08:57:13 EST 2008 | tonyamenson

We test for board cleanliness using an ionic tester. It's been my experience that if your board is clean you take away the possibility of growth even if the unit encounters moisture. We actaully had a problem where our wash lost pressure due to a mi

Fuji Programming

Electronics Forum | Thu Feb 21 15:11:29 EST 2008 | jlawson

Gerber standard has been around for long time as a fabrication data model for PCB makers, but not very useful for assemblers as no centroid data is actually present in the data. Also netlists are no supported and have to be calcualated with software

Tented Via's

Electronics Forum | Fri Feb 22 16:49:44 EST 2008 | pms

Steve, Trying to keep wave solder from coming up the via' from the bottom and adhering to the via's and via's pads during wave. We use WS flux thru-out the whole process. I have been concerned about possible flux intrapment in the via's. That's a g

0201

Electronics Forum | Wed Feb 27 04:23:13 EST 2008 | fujillews

Hi It is best to fit the VGA camera for 0201 parts make sure your software is high enough..above v1.33 although you can place without but no so good. 0.4mm tapered nozzles are best. 0201 feeder the locator base in increased by aprox 0.3mm and the ind


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