Electronics Forum | Tue Aug 27 22:07:45 EDT 2002 | davef
Pad. Land. A portion of a conductive pattern used as a termination area. Metal surrounding a hole on a printed circuit board. Mask. A material applied to allow selective etching, plating, or protection of the surface of a printed circuit board.
Electronics Forum | Wed Aug 28 11:52:24 EDT 2002 | lysik
What kind of print problems are you Having? Off pad, Voids? Or is it slumping, etc? You really should be all set with OSP boards. If I can get some more specific info I could probably help.
Electronics Forum | Thu Aug 29 09:55:37 EDT 2002 | davef
Sounds like hyper-corrosion of nickel, commonly referred to as 'black pad', in ENIG solderability protected boards. Search the fine SMTnet Archives to get started. Additionally, the July - September 2002 'Journal Of Surface Mount Technolgy' has an
Electronics Forum | Thu Sep 12 16:17:07 EDT 2002 | soupatech
There seems to be less play in the pocket than with other parts i've loaded. I was assuming the large nozzle would work better but for reasons unknown to me it didn't. I also tried a 1mm and had parts all over the machine (can you say hand place 100+
Electronics Forum | Mon Sep 09 10:50:24 EDT 2002 | bmulcahy
Hi MK, It not really as simple as changing from one to the other. VIA hole, PTH hole sizes may need to be changed. Really the designer should re-evalaute the board before changing. Also remember your soldering profiles, both reflow and wave (if appl
Electronics Forum | Mon Sep 09 11:02:45 EDT 2002 | mk
No change in Vendor. Here is some additional info from this morning, There are no shorts, opens, or visible defects. The problem is that when the boards are ICT'd, the values of the resistors, caps etc are measuring out or tolerance????? Can the go
Electronics Forum | Mon Sep 09 11:20:50 EDT 2002 | ksfacinelli
I have never seen that occur when using gold plating vs. HASL. I am a big fan of the gold process and have achieved very consistent quality. Did the board vender do an impedance measure to validate you design?
Electronics Forum | Thu Sep 19 21:26:52 EDT 2002 | davef
Sam, You're correct. And that's what Joe would prefer to do with his contaminated boards, but he's trying to keeping line running, I believe.
Electronics Forum | Sat Sep 28 05:30:44 EDT 2002 | ivanchu
Stencil cleaning process is taking by machine every 15 boards. We are using wet, vaccune, Dry, Dry cleaning process. The aperture of the stencil is fullfil the aspect ratio.
Electronics Forum | Tue Sep 24 23:03:14 EDT 2002 | redmary
we used the ball bonding, just normal chip on board. as I know the the electroless Ni/immersion Au, the gold thickness is about 0.13um at most, what about chemical plating or electrolytic plating? any experience on it, thanks
