Electronics Forum | Sun Apr 18 19:18:28 EDT 1999 | Wayne Bracy
| | | | Please visit our Web site, especially 'link page', to get some hint for roll typr of cleaning wiper for automatic screen printers. http://www.squeegee.co.kr | | | | | | | Idiot: I wouldn't visit your site if I had to start using toilet pap
Electronics Forum | Mon May 14 09:43:37 EDT 2001 | orbotech
As the face of business changes through revolutionary factors, such as the increasing rate of outsourcing, manufacturers (especially EMS plants) will strive to fine tune their test strategies to ultimately improve and sustain product quality and to r
Electronics Forum | Thu Jun 22 12:06:10 EDT 2000 | Wolfgang Busko
Hi Sal, I assume your homeplates are designed with the peaks towards the componentcenter. I can imagine that due to placement inaccuracy not both sides sit in the same amount of paste and that wetting difficulties prevent same force factors for both
Electronics Forum | Wed Apr 25 16:35:55 EDT 2001 | Steve
Most of the time, we have very few skewed parts so I feel comfortable about the processes in general. However once in a while, often enough to throw off the first pass yield, we will get a few boards with a lot of skewed parts. By skewed I mean that
Electronics Forum | Sat Jul 21 08:45:10 EDT 2001 | davef
In the past, we have spoken [typed?] about controlling the temperature and humidity of our plants. And it's probably good to do that from solder process control, ESD danger reduction, and human factors stand-points. We are looking to lower our ener
Electronics Forum | Fri Jan 14 16:58:20 EST 2000 | Dave F
Dave: You're probably correct about too much paste, given that your balling is congrigated near the center of the chips. Three things to consider: 1 Lower temperature profile @ front 3 zones 2 I've heard some stencil suppliers can plate addition
Electronics Forum | Fri Jan 14 17:24:08 EST 2000 | John Thorup
Yeah, it would be kind of expensive to replace all of your stencils but it's the only real answer. Be sure that all your new and replacement stencils have a home base or home plate shape for the passives. This reduces the paste volume near the cent
Electronics Forum | Thu Dec 16 20:55:09 EST 1999 | TNT
Hey Henry, Tombstoning can result from many different conditions: 1. Look at the part placement under a microscope before the board has been reflowed. Is it centered perfectly on the pads? If not, the part might migrate towards one pad during reflow
Electronics Forum | Wed Nov 10 18:02:54 EST 1999 | John Thorup
Hi Dave Sounds like what we call a "squeeze ball". Usually caused by excess paste squeezed over the mask between the pads of the component when placed. This sometimes escapes the pull of surface tension back to the fillet and escapes to the side, us
Electronics Forum | Fri Aug 13 13:38:23 EDT 1999 | Bian Wycoff
| Has anybody adopted the method of stencil printing with the board at a 45 degree angle to the squeegee blade? What are the benefits and drawbacks? I've heard you get better fine pitch results. | | TX | Mark | I have used thetechnique extensiv
