Electronics Forum: /08 (Page 601 of 1615)

ive solder profiles

Electronics Forum | Mon Aug 11 02:00:04 EDT 2008 | chrispy1963

GR@ICS, I copied and pasted all of the thread here including the photos and sent them to our programmer for the machine. I will get back to you if he doesnt come on here himself and respond to your problem. Hopefully we will have an answer for you

ive solder profiles

Electronics Forum | Mon Aug 11 10:48:06 EDT 2008 | realchunks

Too much flux will spatter and can leave balls on either side. From your pix you may too little flux. Try turning up and see. Also try hand applying your alcohol based flux and running through. Will take away a few question marks.

ive solder profiles

Electronics Forum | Wed Aug 20 12:04:06 EDT 2008 | grics

I would like to thank everyone for their help on this one...We havent had the board back at S E L E C TIVE on this yet, But I will keep all updated (if there is the care for it... Thanks again

wave finger cleaner solution

Electronics Forum | Fri Aug 01 09:44:42 EDT 2008 | pjc

Try Zestron Vigon RC 101. This mixes with tap water. Electrovert does not recommend DI water due to its corrosive nature. http://www.zestron.com/fileadmin/zestron/overviews-tis/usa/ti/ti-vigon-rc101-usa.pdf

QUAD 4C T axis

Electronics Forum | Sat Aug 02 15:00:12 EDT 2008 | miroyu

I built aluminum cage add ground wire to it but my problem is not gone!Also , video is not in focus.How can I make it right.Does this shows that quadalign board is foulty? Any comments PLS? Thank you Miro

SnPb contents

Electronics Forum | Fri Aug 01 07:59:35 EDT 2008 | kudamarani08

Where from the earth you came from my friend?? Have you not considered 3rd party analysis who are capable of complying J-STD 006 solder alloy acceptability..

SnPb contents

Electronics Forum | Mon Aug 04 14:54:09 EDT 2008 | blnorman

J-STD-001 Table 5-1 lists the allowable impurity levels for SnPb wave solder pots.

solving tombstone

Electronics Forum | Fri Aug 01 00:22:46 EDT 2008 | fowlerchang

Pattern design, paste volume,printing misalignment, place misalignment,reflow process include N2 usage. All the factor above can make tombstome happen. And the most important factor is placement misalignment except design issue. But pls check the sol

Oxidation on PCB's

Electronics Forum | Mon Aug 04 10:15:55 EDT 2008 | realchunks

Silver saver paper will work as well. Most board houses slip a sheet between your boards when they send them to you. Keep this paper with the boards and keep them sealed if possible.

Dual Process for Reflow

Electronics Forum | Fri Aug 01 11:59:57 EDT 2008 | jax

I do not really follow what your are asking but... If you want to know if you can run Leaded and Lead-Free products in the same reflow oven, the answer is Yes.


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