Electronics Forum: had (Page 603 of 728)

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Tue Sep 21 08:49:59 EDT 1999 | Chad Notebaert

| | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | thanks | | | We use 6 mil lasercut stencils with 15% redu

Re: MicroBGA printing problem

Electronics Forum | Wed Sep 22 21:23:03 EDT 1999 | se

| | I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | | The stencil is 6 mil thick, laser cut and electo-polished. | | The apertures are 12 mil in diameter with 20 mil pitch. | | We

Re: MicroBGA printing problem

Electronics Forum | Thu Sep 23 12:47:48 EDT 1999 | Earl Moon

| | | I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | | | The stencil is 6 mil thick, laser cut and electo-polished. | | | The apertures are 12 mil in diameter with 20 mil pitch.

Re: Soldering to Gold

Electronics Forum | Thu Sep 16 20:55:35 EDT 1999 | Dave F

| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re

Re: Tombstone

Electronics Forum | Tue Sep 14 10:54:37 EDT 1999 | Scott Davies

| Can anyone out there pls enlighten me on how to solve chip tombstone defects. | I am running a board with a lot of 0603 chip. i had fine the profile and the alignment, but it still happen randomly on the board itself. Is there any other way to sol

Re: Cost Per Placement

Electronics Forum | Tue Sep 14 13:48:34 EDT 1999 | Doug Philbrick

| | How is cost per placement calculated? | | | Let me count the ways. Oh, this is not Jennifer to whom I'm talking. No matter, what's your environement? Is it prototype, high mix/low volume, low mix/high volume, etc.? | | It could some down to sim

Re: how to overcome tolerance in automatic alignment

Electronics Forum | Thu Sep 09 09:13:10 EDT 1999 | Scott Cook

| hi, i m college student. i m currently doing my Final year project in PCB drilling. the main task is to design auto feeder which allign the PCB properly in position before drilling take place. the close tolerance becomes a big problem to the precis

Re: Reflowing a thru-hole part

Electronics Forum | Wed Sep 08 21:36:14 EDT 1999 | kyung sam park

| I have a board that has surface mount on both sides . On this board is a 22pin connector which is the only thru-hole part.This part is located on the component side. I would like to reflow this part. Can this be done? If so, how can this be done?

Re: Reflowing a thru-hole part

Electronics Forum | Wed Sep 08 22:48:27 EDT 1999 | armin

| | I have a board that has surface mount on both sides . On this board is a 22pin connector which is the only thru-hole part.This part is located on the component side. I would like to reflow this part. Can this be done? If so, how can this be done?

Re: Reflowing a thru-hole part

Electronics Forum | Wed Sep 08 22:49:38 EDT 1999 | Jason Tomlinson

| | I have a board that has surface mount on both sides . On this board is a 22pin connector which is the only thru-hole part.This part is located on the component side. I would like to reflow this part. Can this be done? If so, how can this be done?


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