Electronics Forum: solder and pot (Page 61 of 209)

Sn99Cu07 and Sn100

Electronics Forum | Tue Oct 18 10:36:46 EDT 2022 | winston_one

Dear proffessionals! Question is about this alloys - Sn99Cu07 and Sn100 (Sn100C,Sn100Ni+ etc.). Is it O'k to mix them? In my case to use Sn99Cu07 as addition to selective soldering machine bath with Sn100C? Main components are the same, but minor add

# of Hours before stainless Wave solder damaged by Lead Free?

Electronics Forum | Tue Jun 28 14:37:43 EDT 2005 | Proy

I'm looking for REAL data about how many hours of Lead Free (SAC) alloy run time it takes to really deteriorate or damage a stainless wave solder pot. Realistically if I TIN purge my wave solder pot, how long will it take to be damaged beyond use or

via tenting and pluging

Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef

Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug

Flux Designations and Composition

Electronics Forum | Mon Jul 12 11:35:27 EDT 2004 | Pierre RICHARD

Here are some answers to my questions after a good research. I also added more definitions that could help understand this esoteric language used in assembly, specially surrounding fluxes and their use. In blue italics are comments and extracts from

Pad and Stencil Design

Electronics Forum | Mon Sep 17 16:03:13 EDT 2001 | jschake

The results from an experiment comparing 27 different combinations of pad dimensions concluded that the pad design with 15 mil pad length, 12 mil pad width, and 9 mil pad separation produced the best assembly yields. A 5 mil thick laser cut stencil

Touch-up and Inspection Process

Electronics Forum | Wed Mar 02 18:46:02 EST 2005 | Austinj

The tendancy always has been "when in doubt, touch it up"... this is not the way to "verify the process" and is not the best strategy for multiple reasons (unessecary rework, additional labor costs, as well as making the solder joint more brittle, [i

SMT Adhesive and Other

Electronics Forum | Thu Feb 07 14:58:08 EST 2008 | operator

We don't have one of those cool air compressed syringes to dispense adhesive. We have to do it by hand. My question is does anyone have any suggestions on syringe size, needle size etc... for successful deposition of SMT adhesive? I know you can go s

Dye and Pry

Electronics Forum | Fri Mar 14 11:25:02 EDT 2008 | hegemon

ol' hege has got to agree with Chunks and Dave. Seems every time there is a problem, the finger is first pointed at the process. For my $.02 it doesn't matter if your process is 100% bulletproof, procurement will screw it up by finding a vendor that

Pick and Place Nozzles

Electronics Forum | Mon Aug 18 15:03:38 EDT 2008 | awegener

I'd like to get more information about pick and place nozzles. How can I learn more? ... What do the nozzles look like? Are there different shapes? Are custom nozzles sometimes used for custom parts or are the nozzles mostly standardized? What kind

QFN's and LGA's

Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis

QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in


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