Electronics Forum | Mon Aug 22 09:23:55 EDT 2005 | rjmfigurelli
Sample Profile to avoid solder balls.
Electronics Forum | Mon Aug 22 09:25:54 EDT 2005 | cyber_wolf
Consult your solder paste supplier.
Electronics Forum | Mon Aug 22 10:16:26 EDT 2005 | davef
There's a lot of sources of solder balls. Search the fine SMTnet Archives for previous discussions.
Electronics Forum | Mon Aug 22 20:02:06 EDT 2005 | chad
SolderMask, Inc. in Huntington Beach. Ask for Frank Kurisu. Ph: 714-842-1987
Electronics Forum | Fri Sep 02 11:44:59 EDT 2005 | Brian
We (ETS) are a manufacturer of reflow, curing and preheat systems and have had similar requests from customers in the past. One in particular required soldering onto an aluminum heat sink weighing approx 5 lbs. You might consider selective/robotic so
Electronics Forum | Sun Aug 28 09:23:52 EDT 2005 | davef
Sara Rice: How did you determine the balls were entrapped?
Electronics Forum | Thu Sep 01 09:05:47 EDT 2005 | russ
Thermal pads located underneath leadless devices require a 50% reduction in the stencil aperture.
Electronics Forum | Thu Sep 01 11:25:21 EDT 2005 | chunks
Unless it is peppered with via holes. Then it depends on the size of the pad and via holes.
Electronics Forum | Tue Aug 30 10:48:18 EDT 2005 | cmiller
If you do not have a lot of TH joints there are some advantages. No boards "submarined" in solder pot on wave. You can solder the bottome side SMT parts rather than epoxy them when the parts are put down. This should reduce SMT defects and missing pa
Electronics Forum | Thu Sep 01 02:47:01 EDT 2005 | stalkerb
Thanks Cmiller & PR, I am warmed to hear others are doing this sort of thing.......like all inovative ideas, you often stumble into them. As far as im aware the ERSA dual Pot is the only machine avaiable on the market that can do this sort of thing
