Electronics Forum: ceramic (Page 62 of 74)

Tilted/Slant SMT Component Specs?

Electronics Forum | Wed Mar 27 19:26:53 EST 2002 | ianchan

After a whole night's self review, I think we can term the slant/tilt as "floating 0805, yet end-terminals have acceptable solder joint formation". the width portion of the 0805 RES/CAP is (floating)elevated from the PCB pad, yet both (width) termin

Reflow PBGA

Electronics Forum | Wed Jun 26 00:49:52 EDT 2002 | ianchan

Steve, I'd second Daan's opinion. BGA profile we use gets a peak of 210deg-C to 223deg-C (but that's using our WS paste unique characteristics) with reflow zone holding time of 45-60sec. We had 6 PBGA and 2 ceramic BGA on a 6 layer PCB. typical p

SMT

Electronics Forum | Thu Aug 22 22:09:05 EDT 2002 | davef

Determine the number points (parts) on a pc board to be measured/connected in temperature profile according to the purpose of the profile. For instance: * A thread here on SMTnet recently discussed �copper plate� profiling. It is used primarily for

X-Ray Inspection for BGA, CSP etc.

Electronics Forum | Mon Feb 10 09:49:32 EST 2003 | pjc

For manual X-ray systems: Kv power to start off with. Depending on what type of components you have to X-ray, you may be ok w/ just a 90Kv system, for example. Its not all about Kv though. With most systems you can adjust to quantity of X-rays you ar

Thermo-couple attachment

Electronics Forum | Wed May 07 09:31:28 EDT 2003 | davef

We use uV Dymax glue for thermocouple attach sometimes, but don't like the remainder [anal] and loosing attach, sometimes. Roger Saunders, President Saunders Technology, Inc; said: PRO: � These products are easier to use than high temperature solde

Reflow of SMT Glue / Adhesives

Electronics Forum | Tue Jun 17 01:27:25 EDT 2003 | Dreamsniper

Hi Guys, I need your opinion here. Has anyone tried doing this Process: Bottomside Process first which means gluing the chip components then reflowing the Glue instead of Curing them, then Topside process which is solder paste printing then compone

solder fillet peeling update....

Electronics Forum | Fri Jul 11 10:00:05 EDT 2003 | davef

Component manufacturers recommend limits on the power and period of ultrasonic cleaning. Examples are: * PRECAUTIONS AND GUIDELINES MULTILAYER CERAMIC CAPACITORS: (9) Ultrasonic cleaning time shall be ten minutes maximum. When the power of ultrasoni

No Lead BGA Hot Gas Rework

Electronics Forum | Tue Apr 13 22:48:11 EDT 2004 | Ken

I assumed the balls were tin/silver 221C or tin/silver/copper 218C liquiduous....but, this is obviously not the case. It looks like you balls are almost pure tin (mp=238C) You are correct. This is exactly the same as using 10/90 high temp balls o

smt codes

Electronics Forum | Tue Aug 24 23:04:14 EDT 2004 | pdeuel

If this code is on a ceramic cap then it is a 0.1uf cap. We have a conversion charts that list most all codes. Useing the last 2 digets only determine the value. The capatol letters A thru Z are given specfic numerical value. Example A0 is 1.0pf, A1

Lead free profile

Electronics Forum | Thu Jan 27 15:13:26 EST 2005 | jbrower

Hi Tom, Thanks for the compliment. I've been researching and planning for the time that my company would go lead free since late in 1999. I hear you there, how do we know that the component is lead free. Baring a leap of faith with your vendors, I


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