Electronics Forum | Wed Feb 12 10:03:47 EST 2003 | stefwitt
Greg, you pointed out yourself the many advantages of bulk feeding. I would like to mention that the higher component accuracy and the feeding track accuracy of the bulk feeder contribute to an improved pick failure rate of small ( 0402�s ) component
Electronics Forum | Thu Apr 10 15:20:35 EDT 2003 | MA/NY DDave
Hi DaveyF, Thanks You see, you proved my point, with piles of more information than I gave. Based on Application rather than design and manufacturing specifications, a lower IPC class can out perform another. So our starting Poster must look at t
Electronics Forum | Fri Apr 11 01:01:41 EDT 2003 | kadaba
we are evaluating mirae1025 pick and place machine along with mydata tp9-2u samsung cp45lv has any one got info on mirae and how do you rate this against the other two.. or alternatively should i include anu other similer model. i amd having not muc
Electronics Forum | Mon Apr 28 09:33:34 EDT 2003 | chrissieneale
This may be a really silly question but does anyone pick up and hand place the reject parts from the scrap bins of the machine? My attrition rates are out of control and i think this would not only highlight the problem but also save oodles of money
Electronics Forum | Tue Apr 29 07:12:49 EDT 2003 | Glen barden
Sn/Cu/Ni is introducted to me in wavesoldering lead free process. Around in our industry, we have a plenty of info. about SAC but not on this alloy. The distributor showed me some information about this alloy including less dross, more shiny /smoot
Electronics Forum | Wed Jun 11 17:16:12 EDT 2003 | MA/NY DDave
Hi I had to poke around awhile to see what you meant. I think you were at an advanced level where IF he knew the MSL ratings of his devices he should constrain his profile within the component mfgs tests for exposure to various profiles, or at leas
Electronics Forum | Tue Jun 17 07:17:09 EDT 2003 | James
The main problem I am having is getting the Rising slope 1-3 degrees. If I slow the conveyor down then I have too long of a reflow and if I speed it up then my ramp rate is too high. I was not sure if I need my first zones at a low temp or higher t
Electronics Forum | Thu Jun 19 12:47:47 EDT 2003 | russ
I would believe that the connector spec is for the max temp that it can withstand while the paste is the max temp that you need to achieve. Solder balls are usually from excessive ramp rates in the oven. I would contact the connector mfg. and see wh
Electronics Forum | Mon Jul 07 00:11:10 EDT 2003 | praveen
if the capacitors are placed very near to the edge and their position is 90 deg than it may cause crack.4thly if the reflow ramp rate is more than 3 deg C then it may crack. 5th ly if the solderin tip temp. is very high and soldering bit is very thi
Electronics Forum | Wed Jul 23 17:07:27 EDT 2003 | dbdavis
Dear Colleagues, I'm am experiencing some problems with nonwetting of primarily 0603 packages. The problem is infrequent but occures just enough for my QA dept. to notice. My reflow profile seems to be correct and the vast majority of parts solder f
