Electronics Forum: see (Page 614 of 725)

QFP IC open solder

Electronics Forum | Mon Sep 23 22:31:48 EDT 2002 | davef

Comments are: * It�s interesting, but not surprising that your time above liquidous varies around the sides of this component. * You are correct in thinking that it is better to reduce than to increase the temperature differences around the component

UltraSonic cleaning machine

Electronics Forum | Mon Sep 23 16:54:29 EDT 2002 | bdoyle

Actually I didn't really think it was that blatant. He has something that could solve the problem of the original poster. Instead of putting his company's brochure on the forum he just left it up to the original poster to make the next contact. Pe

baking boards, revisited

Electronics Forum | Wed Oct 02 20:59:23 EDT 2002 | davef

We�ve been stewing on this and it just dawned on us the part that�s missing. Blow-holing is caused by BOTH of the following: * Moisture absorption by the resin that holds the board together. [Steve is addressing this with his various baking schemes

baking boards, revisited

Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis

Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in

Rep Responses in Forum, Possible Guidelines

Electronics Forum | Mon Oct 14 14:07:07 EDT 2002 | davef

Last I checked this thread, you were the person calling me OUT. I�m responding to you, sport. You are the one that�s talking about your technical contributions. I decided to look at history, in case I had over-looked the technical content of you p

Wow! Changes...

Electronics Forum | Thu Oct 17 14:12:27 EDT 2002 | bdoyle

Well I was expecting some questions. If you have the most convoluted system out there, and its up for a while people will figure out how to use it. The thing with MySMTnet is that many people don't necessarily understand it. We had thought with th

Used Equipment Support

Electronics Forum | Wed Oct 30 23:08:25 EST 2002 | caldon

Jeff as far as ladder Logic it should really be quite simple for JOT to configure in fact most people with PLC experience can get this machine running. Look at the PLC in side AB Slick 50, Gould/ modicon, GE, Siemens are a few options of the PLC insi

Handling PCB assy's

Electronics Forum | Mon Nov 04 15:53:49 EST 2002 | kenBliss

Hi Steve I understand your point, the comments on the thread of which are slightly off of the original posted question but it still is handling. Handling is handling. If you pick up a board from one conveyor just to put on another conveyor that is

fillets on fine pitch parts/poor wetting

Electronics Forum | Wed Nov 06 15:47:49 EST 2002 | bpan

Hello All, Having a problem during reflow and would like your opinions. We are using Kester r562 water soluble paste and I am using a Kic 2000 profiler in a 4 zone oven (top only). We are seeing poor wetting or fillets that are not "passable" per IPC

type 3 vs type 4 paste

Electronics Forum | Fri Nov 08 14:48:58 EST 2002 | davef

Yours is (12 thou x12 thou)/(2x(12 thou +12 thou)x5 thou) = 0.60 * Aspect=W/T for electroformed stencils SB GT 1.1 => Yours is 12 thou/5 thou = 2.40 So, we kind of think of what you�re trying do as maybe printing a 16 pitch QFP, which gives you simi


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