Electronics Forum | Fri Jul 14 14:05:55 EDT 2006 | nodlac
Additional to Dave F.... A potato has Iron @ 2.75mg and Magnesium @ 55mg. The leaching of these two meatls could contaminate the solder pot and taint the solder. ----------------------- Additional to my additional..THE SOLDER POT POTATO BATTERY...A p
Electronics Forum | Tue Mar 28 11:17:19 EST 2006 | smartasp
Thanks for the input Guys Yeah the not so knowledgable customer does not like to residues for cosmetic resons. The flux is for lead free process, of the no clean and water soluable type. We have explained to him that technically the residues do not
Electronics Forum | Fri May 12 07:53:40 EDT 2006 | egrice1
Sheldon, Tip life is directly related to temperature, IRON plating thickness on the tip, Alloy composition used and operator technique. High tin contents in lead free alloys attach the tips. Poor wetting and higher melting temperatures cause us
Electronics Forum | Thu May 11 13:28:49 EDT 2006 | patrickbruneel
Being a typically efficient Swiss based company Swatch started the task of RoHS conversion a year ago. After 2 years of intensive research they implemented the process in mass production in June 2005, they started shipping and found massive problem
Electronics Forum | Wed Jun 14 11:37:44 EDT 2006 | shawnvike
find the problem? Were the parts failing > electrically? Or did someone start prying them > and decide they were too weak? Originally found the problem going through some older assemblies that had failed testing. Poked at leads and found them no
Electronics Forum | Fri Jun 09 20:13:36 EDT 2006 | grantp
Hi, We have spent the day trying to profile our Vitroncis Soltec Delta C wave with the new SN100C solder, but having problems with the heavy pins on some BNC connectors we are using. We have Interflux no residue flux, and we are using palettes, whi
Electronics Forum | Fri Jun 16 11:37:15 EDT 2006 | docker
I�m working in Solder paste manufacturing industry and my customer has complained the void issue on BGA pad. I�m internally conducting the void test on BGA pad in my Lab. I used OSP furnish board with Sn/Pb and /or lead free component using Lead free
Electronics Forum | Fri Jul 28 06:16:20 EDT 2006 | pavel_murtishev
Good afternoon, We run mixed LF/SnPb process for most of out products. Most of chip passives have lead free termination and some of them tend towards blistering issue. SnPb solder wets component in very strange way. Wetting phenomena seems to be abn
Electronics Forum | Sun Nov 19 16:37:06 EST 2006 | finepitch
Hi RJK, 2.5 years ago, I pointed out the exact same thing you did now. (please see the below link) http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=7076&#Message28261 I am a competing brand's rep for 3 years, but p
Electronics Forum | Wed Oct 04 09:55:51 EDT 2006 | borgie
Hi. I have product in lead containing process that consist lead free BGAs and also big ceramic BGAs with high temperature bumbs. Pcb tends to bow in a reflow profile, since I need long preheating times and relatively high peak temperature to melt BG
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