Electronics Forum | Wed Apr 16 09:25:55 EDT 2008 | hussman
Do you specify copper weight on your boards? This could be the difference between the the boards. Also the finish will be different between the boards as well. These two factors are enough to cause bottom side parts to reflow and fall off. In eit
Electronics Forum | Wed Apr 16 10:26:27 EDT 2008 | tonyamenson
The problem is there wasn't any reflow when the board went through on the bottom side. Even if they didn't fall off becuase the temp was set low enough, while running the top side, the fact still remains that there wasn't reflow on the PCB pads to be
Electronics Forum | Fri May 02 11:11:49 EDT 2008 | lon_sanders
The cable required for the Thinline has to work as a true RS232 interface as the unit uses all the capabilities of RS232. You will have several problems with substitutes. These cables (part number e00-2787-26) are still avaliable from ECD, the home o
Electronics Forum | Wed Apr 23 10:19:53 EDT 2008 | mikesewell
Has anyone tried to increase the working height on their Mirtec AOI. We have several MV-2HTL machines and have a few boards that are over 2" tall. I'd rather not leave the parts out and have a secondary step to install them after inspection. I've
Electronics Forum | Fri Apr 25 12:36:52 EDT 2008 | fsw
All, Does anyone on the forum have experience with underfill? We have a component with QFN pkg on one of the new products. It has a thermal pad in the centre. Customer wants this component to have an underfill. Questions - 1) Does one normally req
Electronics Forum | Tue Apr 29 11:18:16 EDT 2008 | bandjwet
All: I am interested in how process engineers are both removing and adding markings to active devices. We have a job where we have to both remove the markings of and the re-mark SOICs. The markings on the devices look like they are pad or ink jet p
Electronics Forum | Fri May 09 15:16:42 EDT 2008 | toddl
I thank everyone for their input, I have ordered a few missing parts and will try the auto dispense feature. I believe our production floor humidity is properly controlled so hopefully no problems in that area. I do have concerns with the dispenser s
Electronics Forum | Tue May 06 11:56:56 EDT 2008 | joeherz
We have a board that uses 0402x4 RNET packages that we are having a difficult time getting to solder consistently. Paste deposition is fine (using AIM WS353) and profile is dead-nuts. I'm starting to wonder if this is something that we're just goin
Electronics Forum | Wed May 07 15:36:04 EDT 2008 | llaerum
The 483 is what we use on all boards except on one where the 353 improved wetting on resistor packs. It worked much better since the parts are LF and this is the same flux AIM uses in their LF solder. Yes, it was recommended by AIM when we discussed
Electronics Forum | Thu May 15 12:02:42 EDT 2008 | scotceltic
Japanese (He He) Good one Mark. I have NXT's and I know that the communication for the feeder size and pitch among many other data comes through across a Fuji Open Interface software. (Fuji proprietary software) We use this to talk to our part numb
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