Electronics Forum | Thu Nov 30 11:20:55 EST 2006 | CK the Flip
I'm no guru, but I am among the best that my home state's gotta offer... :-) Anywho.. a Production Manager's definition of cycle time is the time Production Planning schedules the stockroom to start picking materials for the work order, to the time
Electronics Forum | Thu Mar 02 21:24:27 EST 2000 | Dave F
Glen: As I mention in an earlier response in this thread, I think someone at Steve's plant (or may be in his packaging spec for the fabs) is doing something to leave a residue, but I'm also thinking solder mask ... ENIG can be applied before or aft
Electronics Forum | Sat Jan 06 10:52:09 EST 2001 | Steve Thomas
I don't know the specs. of our MSHII's, as I'm sort of detached from that part of the process, but supposedly they are capable. Panasonic also recommends we buy all new feeders (well, big surprise there), because of the risks involved with retrofitti
Electronics Forum | Wed Nov 22 15:09:52 EST 2000 | Finepitch Services
Chryzs, I've used AIRVAC and SRT (with their old adjustable 4 piece nozzle system). I also saw the APE Chipmaster... Here's my 2C after all that: Whoever claims he/she has a user friendly system is a big liar. The words are correct but the order is
Electronics Forum | Tue Nov 14 13:39:37 EST 2000 | Mark S
Hi All -- I'm about to design a DPAK part (case 369A-13, Issue Z)onto a PCB . The part's maximum length as given in the datasheets (On-Semi MAC4DHM) is 0.030" longer than the recommended land pattern as given in that same datasheet. (1) Has anybod
Electronics Forum | Tue Nov 07 10:25:19 EST 2000 | Thomas Ballhausen
Thank you for your kind contribution and efforts in helping me. I just found out we have been talking different units; my microns were micro meter ...? So, let me get things right now: the substrate supplier confirmed the following data: Cu foil +
Electronics Forum | Tue Sep 26 09:42:38 EDT 2000 | Chris May
I have to agree with Wolfgang & Jacko. Two months ago, I decide to run a lead free paste trial. The paste was supplied by company "X", and they stayed on site to witness evaluation. I trialled the paste using EXACTLY THE SAME equipment, stencil and
Electronics Forum | Mon Aug 28 14:12:51 EDT 2000 | Earl Moon
1/4 thimble! Obviously, you read none of may articles. HASL has more than a simple topographical problem, and so on. You also would know that TCE, while being an important issue, can be overcome as a problem with optimized pad designs. You would kno
Electronics Forum | Tue Jul 18 11:50:26 EDT 2000 | Jeff Sanchez
Hey all, My brother is a tech at TI. He is running tests on bump dies. The question is if he heats up a die (actual waffer) with out disrupting the solder can he still use the solder. Will the solder lose its integrity? Keep in mind that these
Electronics Forum | Tue Jul 04 16:13:09 EDT 2000 | TOOLMANTIM
HELLO BILL I HAVE SOME QUESTIONS FOR YOU 1:HOW ARE YOU CLEANING YOUR STENCIL 2:ARE YOU SINGLE OR DOUBLE PRINTING. 3:ARE YOU USEING VACUUM FIXTURES OR NOT? HERE ARE SOME OTHER THINGS TO TRY. IF YOU ARE CLEANING YOUR STENCIL OFTEN BECAREFUL OF USEING
