Electronics Forum | Fri Nov 03 02:32:56 EST 2006 | shivam
HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer
Electronics Forum | Thu Nov 09 15:00:59 EST 2006 | jwentz
Shipping might be an issue for you but I have a VIP70A in storage that is roughly the same vintage but in really good shape for $5000. We pulled it from service last year to bring in a more Pb-Free capable oven. We are still running a sister oven on
Electronics Forum | Mon Dec 11 17:19:12 EST 2006 | darby
Hi AJ, Thanks for the reply. I'm beginning to think that we have some issues with different expansion rates of the two pcbs. When you say you had some profile issues... Did you stay within the recommended UBLOX reflow time of 20 - 40 seconds and di
Electronics Forum | Fri Dec 22 07:11:32 EST 2006 | billyd
Wait a second... 10 to 15 mils at toe end. How are you doing that? See, the ones we did have a bit of a time with had no catellations on the outside. So, it's like a BGA in that regard. All your paste goes under the part, so if it's not even, or if i
Electronics Forum | Mon Dec 25 12:17:57 EST 2006 | KEN
first, does the recipe have the heat and conveyor boxes checked? If no then it does nothing. second, have you pressed the round green switch? third, are there any alarms in the alarm box? Do you have a controller link fail? Verify the cable is p
Electronics Forum | Wed Feb 21 21:01:57 EST 2007 | davef
Yes. Heat reduces OSP solderability protection thickness. For instance, many OSP are shot at the end of the first reflow pass and the exposed copper is free to oxidize. If you're speedy, you can pull-off the second reflow cycle before the copper g
Electronics Forum | Tue Jan 16 11:24:47 EST 2007 | realchunks
I think John is right. I've seen the same thing (I think, without a picture who knows)on heavy heatsink parts. But I've also seen this happen on larger parts that move right after being wave soldered. I'm talking within a second or two of being so
Electronics Forum | Tue Jan 16 07:51:19 EST 2007 | realchunks
Your Quality Manager won't let you make changes, yet you get blammed for process problems? First, you need a change in management. Second, if you can't change set pre-heat temps, change the conveyor speed. Slow it down and see if your joints loo
Electronics Forum | Thu Jan 25 17:14:44 EST 2007 | slthomas
Good luck with that. ;) More likely you'll have to adjust your profiles. In our case with the palladium terminations we had to touch them up. There were other parts on the board that couldn't take more than 5 seconds at ~235 C� (don't remember for s
Electronics Forum | Fri Feb 09 01:41:46 EST 2007 | Muhammad Haris
CHECKS FIRST that your BGA doesn't tilt from pick & place machine. SECOND lead free paste have some problem that it solder the component whereever pick&place put the component while solder pastes having lead, put the component on its PCB pad like a
