Electronics Forum | Wed Jul 17 17:56:38 EDT 2019 | rgduval
Check the MOT board. You can usually swap out the individual MOT boards, and see if the problem moves. If it does, you can isolate which board has gone bad. You can also check the encoder on the conveyor, to make sure that is still working correct
Electronics Forum | Thu Aug 22 16:25:18 EDT 2019 | scotceltic
Yes, unfortunately a lot of datasheets these days do not contain the temperature resistance to determine if it can handle the PIP application. In the past I have always used a 250 C at a min of 5 sec for the material. Also, the part should have sta
Electronics Forum | Tue Jul 23 11:06:00 EDT 2019 | majelacquinn
Currently trying to get away from using stencil printing. Looking for information on Micro-Dispensing and dot size using a Vermes MDV-3200A micro jet dispenser. I am using a Indium led free solder that has size 6 balls. With a 100 micron dispense hea
Electronics Forum | Tue Jul 30 12:46:15 EDT 2019 | davef
I'd be surprised if CCGA leads were getting bent or tilted during the reflow soldering process. If they were bent during handling, that would be less surprising. 235*C on the body for a minimum peak temperature of 208*C at the connecting leads does
Electronics Forum | Thu Aug 22 22:19:13 EDT 2019 | sssamw
From the picture you present, it is a pin in paste part with pin length 2.2mm (a good length for 1.6mm PCB thickness), and seems the pin tilted and touch on PCB surface, thus causes up-part. Sorry I cannot image pin tilted not before placement but i
Electronics Forum | Wed Dec 11 06:34:24 EST 2019 | ameenullakhan
Hi Everyone, Reducing the top heaters around 10 deg each at last 3 zones of reflow oven. Helped us in achieved little lesser temperature at top connection of the CCGA. And we didn't face any bent. Bridging : Reducing the stencil aperture , has wor
Electronics Forum | Thu Jul 25 07:50:37 EDT 2019 | jmedernach
Hi Folks, It's been a coon's age since I've been on here. I'm wondering if the community can't help me out with something. "Back in the day" there were thermocouples made by Saunders, Temprobes, with a design that would clamp on the board edge. Yo
Electronics Forum | Thu Jul 25 08:58:22 EDT 2019 | Matt
Hey all, i'm hoping to get some feedback from the community on baking process versus a dry box. current process we have for rework of PCBs is to perform a 16 hour bake cycle on hardware before BGA rework is performed. however this process is ineffi
Electronics Forum | Tue Jul 21 05:08:16 EDT 2020 | arty vesna
Hi there. I am currently kinda in the same spot as the author of the thread. My choice is between Rehm VXC and Heller 1809. I am a little concerned about Heller advertising their 25cm/10 in zones. I am used to large ovens designed for high throughput
Electronics Forum | Tue Jul 21 10:38:54 EDT 2020 | artyvesna
Thanks a million. We are quite restricted with available length for the oven (about 5meters/16.5ft).Throughput itself is not so much of a concern, it is ability to be precise with thermoprofiles together with some future proofing (extra capacity) tha
