Electronics Forum: 125 (Page 7 of 42)

Over baking BGA- ?

Electronics Forum | Wed Feb 15 04:25:56 EST 2006 | der

one of the guys was baking a 672BGA . he mistakenly left the oven on over night so instead of baking for 12 hours at 125 degrees C, they got baked for 24 hours. Is there any detrimental impact on the BGAs or are they just well baked???

Fighting solder beads

Electronics Forum | Tue Mar 21 02:15:26 EST 2006 | pavel_murtishev

Good morning Dave, Here are some of my assumptions. Please correct me if I am wrong. 1. Mask opening. Due to mask to PCB misregistration mask is not always centered relative to pad center how is should be. Sometimes edge of the mask matches with ed

Board Baking recommendations

Electronics Forum | Mon Jan 08 10:41:50 EST 2007 | jaime39

If you bake the boards at 125 degrees celcius for about 4 hours it should work. I would also suggest that you talk to the PCB supplier to take care of this baking for you. NOTE: PCB�s with an Entek or any other type of OSP finish should not be baked.

TCE mismatch

Electronics Forum | Wed Feb 07 18:40:39 EST 2007 | bill

What is an acceptable mismatch for smt components and pcb. We are having cracked solder joints from fatigue after repeated thermal cycling 25 deg. c to 125 deg.c.

Baking MSDs in tubes?

Electronics Forum | Mon Mar 26 17:02:55 EDT 2007 | muse95

That's what I thought. The humidity req't would be a non-issue when you are able to bake at 125C. Can you share details on how you bake at 70C?

Wire prep

Electronics Forum | Tue Aug 28 15:16:06 EDT 2007 | rgduval

Sorry...make that .750 long wires, with .125 strips. My mechanical mind was working, but the fingers couldn't translate correctly.

Baking components at 70 degree

Electronics Forum | Tue Jun 17 20:59:07 EDT 2008 | fowlerchang

And we have evaluated this process before 2001. And it is widely used in our company world wide. And we don't control the rate of the drop in pressure, because it is same as 125 degree at normal pressure condition.

Baking components at 70 degree

Electronics Forum | Tue Jun 24 21:01:27 EDT 2008 | fowlerchang

Qulification the baking process of 70 degree and 24 hours below 10Pa. We have the experiment data which shows the weight of baked water from package with this condition is more than 125 degree at normal condition.

Baking components at 70 degree

Electronics Forum | Wed Jun 25 08:06:04 EDT 2008 | davef

Questions are: * What does "weight of baked water from package with this condition [70 degree and 24 hours below 10Pa] is more than 125 degree at normal condition" mean? * What is "normal condition"?

PCB Delamination

Electronics Forum | Fri Feb 01 05:40:17 EST 2008 | aj

we have also seen this issue but seems to be on boards whee there is a open space and no copper hatching. We bake these boards out for 4-6 hrs @ 125oC. aj...


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