Full Site - : underfill (Page 7 of 93)

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Videos

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Heller Korea Ltd.

DV-7000 Heli-Flow Pump

DV-7000 Heli-Flow Pump

New Equipment | Dispensing

The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,

ASYMTEK Products | Nordson Electronics Solutions

Forte - Advanced Dispenser

Forte - Advanced Dispenser

New Equipment | Dispensing

The Forte™ Series delivers exceptional dispensing productivity and accuracy for high-volume consumer electronics manufacturing, printed circuit board assembly, flexible circuit, MEMs, and electromechanical assembly applications. Next-generation and

ASYMTEK Products | Nordson Electronics Solutions

DV-8000C Heli-Flow Pump

DV-8000C Heli-Flow Pump

New Equipment | Dispensing

The DV-8000C series Heli-Flow® pumps are the newest generation of encoded auger pumps. The pump has a fixed-head design for luer needle applications. The DV-8000 pump's rigid head and fluid path can withstand high pressures generated by thick fluids

ASYMTEK Products | Nordson Electronics Solutions

Fids-on-the-Fly High-Speed Fiducial Capture

Fids-on-the-Fly High-Speed Fiducial Capture

New Equipment | Dispensing

Nordson ASYMTEK’s Fids-on-the-Fly™ option is up to 5.5X faster than the traditional stop-and-capture mode for locating fiducials. Reducing time spent performing this essential, non-dispense routine can increase UPH as much as 35 percent. Fiducials a

ASYMTEK Products | Nordson Electronics Solutions

Camalot Announces PCB Temperature Monitoring on Prodigy Dispenser to Ensure Underfill Process Stability

Industry News | 2020-04-14 18:28:48.0

ITW EAE is introducing a patent pending option for the Camalot Prodigy dispenser that was developed to ensure process stability and increase yields for underfill applications. In applications where board heat is required, a constant product temperature through the dispense process is critical to ensure process stability and repeatability. Underfill materials vary in viscosity and filler types, therefore the heat requirement for the board also varies.

ITW EAE

Nordson ASYMTEK Introduces Continuous Path Motion Control Software

Industry News | 2013-08-20 23:02:16.0

Nordson ASYMTEK has developed Continuous Path Motion Control software for jetting underfill for flip chips. The software optimizes dispense head motion, saving time and increasing units per hour (UPH). Instead of stopping to move between die, backtracking, ramping to speed, dispensing, and decelerating, the dispense head maintains a continuous speed and direction throughout the process.

ASYMTEK Products | Nordson Electronics Solutions

NexJet NJ-8 System with ReadiSet Jet Cartridge

NexJet NJ-8 System with ReadiSet Jet Cartridge

Videos

The NexJet® 8 System with ReadiSet™ Jet Cartridge offers increased jet frequency combined with advanced consumable management - it's as easy as ReadiSet and Jet. Read more at http://www.nordsonasymtek.com/nexjet

ASYMTEK Products | Nordson Electronics Solutions

DJ-9500 DispenseJet High-Speed Jet Dispensing

DJ-9500 DispenseJet High-Speed Jet Dispensing

New Equipment | Dispensing

The DispenseJet DJ-9500 supports a long list of jettable fluids for a wide range of applications. Incorporating over 15 years of jetting experience, the DJ-9500 jet provides even more capability than its DJ-9000 predecessor. Nordson ASYMTEK's jettin

ASYMTEK Products | Nordson Electronics Solutions

Reflow Simulation – X-ray & Optical Help Solves Design & Process

Events Calendar | Mon Apr 06 00:00:00 EDT 2020 - Mon Apr 06 00:00:00 EDT 2020 | ,

Reflow Simulation – X-ray & Optical Help Solves Design & Process

Surface Mount Technology Association (SMTA)


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