Electronics Forum | Tue Jun 11 14:16:03 EDT 2013 | bandjwet
We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi
Electronics Forum | Tue Jun 11 14:21:35 EDT 2013 | bandjwet
We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi
Electronics Forum | Tue Sep 21 09:33:30 EDT 1999 | Scott Davies
| | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | thanks | | | | | We use 6 mil lasercut stencils w
Electronics Forum | Mon Apr 19 15:27:05 EDT 2004 | pjc
The MicroFlex is not really new. Its the UltraPrint 100 re-engineered and improved. UltraPrint 100 / SMTech 100 has been around for many years. I don't believe the DEK 248 offers a Stencil Wiper option. I worked on MicroFlex machines. Vision system i
Electronics Forum | Wed Feb 07 09:46:20 EST 2001 | pjc
I need some guidance here. I've got a new board w/ a FBGA-48 package, Samsung CMOS SRAM. It's a full matrix BGA w/ 0.30mm-0.40mm ball diameter @ 0.75mm pitch. Balls are eutectic. PCB land diameter is 0.4mm. There are TSOP I 0.5mm lead pitch component
Electronics Forum | Wed Aug 24 16:30:11 EDT 2016 | shawn_halo_1
I have a 1oz Flex PCB (FPC) that has 2 0.4mm pitch connectors that need to be SMTd and 9 4.5x1.0mm pads that have conductive rubber contacts that are press fitted onto the FPC. The FPC has a one time bend radius of 15.5mm. Image is attached that show
Electronics Forum | Mon May 20 12:01:37 EDT 2019 | gregoireg
I have a PCBA job which has on the top side a few standard QFN components (0.4mm pitch) and a big module (35mmx60mm) with 1.13mm BGA pads: https://imgur.com/a/YUGgejW To be clear, this module is composed of a PCB with some components on top and some
Electronics Forum | Mon Apr 29 14:36:26 EDT 2013 | bandjwet
I am trying to determine who out there is reballing devices below 0.4mm in pitch. We have been reballing as small as a 4-balled 0.15mm 4 mil ball diameter area array devices using an adhesive-backed reballing preform. 1. For such small devices we h
Electronics Forum | Thu Mar 15 18:15:28 EDT 2018 | maustin
The 740 has been a great machine for us. We've been able to reliably load components as small as 0603 (we've not tried 0402, but I believe with a special nozzle adaptor, you can get it to work) and place a 7x7 56 pin QFN with 0.4mm pin pitch with hi
Electronics Forum | Fri Jun 16 06:24:43 EDT 2000 | Wolfgang Busko
Hi Todd, it might be a philosophical question if soldermask between finepitch pads is prefered or not. That should depend on the capabilities of a particular site and their experience. We actually prefer soldermask down to 0,4mm pitch and don�t have
