Electronics Forum | Fri Jan 03 10:32:42 EST 2020 | emeto
Zack, circles 36mil copper 35mil circle stencil aperture. Pitch is 80mil. Stencil is 5mil and apertures are spread 46mm under the 50mm component size. In my mind this might be too much paste. I am afraid that if I print 4mil I might get open joints
Electronics Forum | Mon Jan 15 10:32:18 EST 2001 | johnthor
I have to agree with you Wolfgang. Admittedly it's my first look at it but I don't think my opinion will change much. At this point I wish I had taken the time to respond to Brian's request to beta test the "new" site. Maybe I could have made a di
Electronics Forum | Thu Dec 02 10:32:47 EST 1999 | Boca
Curtis, They have a 'permalex' coating bonded to the metal. We see no signs of flaking. They are pricey but they do work, we had metal blades from the OEM, they were absolute trash (not MPM). We run 16-6 and they last at least 4 to six months in
Electronics Forum | Wed Jul 01 10:32:01 EDT 1998 | Eric Klaver
| How can I reach Tesa? I've tried to find a website that contains some useful information but no luck. | By the way, Siemens has stonewalled me regarding their tool/material. Seems to be reserved for Siemens | users exclusively. Joe, The address
Electronics Forum | Mon Apr 06 10:32:53 EDT 1998 | Justin Medernach
| Peter, | Take a look at IPC-ANSI J-STD-001A and B, J-STD-004 and I think, 005/006 which cover solder paste (?) I think. | Whatever, they do reference one another. | | Question: Whatparameters are used to determine "good" Solder Paste? What refer
Electronics Forum | Wed Mar 27 10:32:29 EST 2002 | barryg
hello evryone. I am rleatively new to smt production. Though we have been successfully running pcb assy's and getting very good solder quality we are trying to get some proccess control parameters set up for our printing process. We have a semiauto s
Electronics Forum | Fri Feb 28 01:10:32 EST 2003 | MA/NY DDave
Hi I don't know what FR4 you are using, so check it out to make sure 125 isn't too high. I have seen this done occassionally when the PCBs have bad moisture or other problemx where baking helps prior to assembly and solder, yet I haven't seen it do
Electronics Forum | Wed Apr 28 10:32:19 EDT 2004 | vickt
This was not a automatic feature of the 4796 series HSPs. You can try to continue to reset-start the feeder crg after each component missing event,and slowly build the remaining placements, but at some point you will reach a dead end. My best advice
Electronics Forum | Wed Sep 08 10:32:39 EDT 2004 | C Lampron
Good Day Everyone, I have a Class 3 medical customer where we are seeing solder balls adjacent to the fine pitch device leads post reflow. We are processing these with OA so small amounts of solder balls usually wash of at clean. These however, are
Electronics Forum | Thu Aug 25 10:32:03 EDT 2005 | davef
IPC-2221A, Generic Standard on Printed Board Design, the base document that covers all generic requirements for printed board design, regardless of materials. From there, the designer can choose the appropriate sectional standard for a specific techn
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