Training Courses | | | IPC-7711/7721 Trainer (CIT) Recert.
The Certified IPC-7711/7721 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-7711/7721 Trainer (CIS) training.
Technical Library | 2016-09-15 17:10:40.0
This paper describes the purpose, methodology, and results to date of thermal endurance testing performed at the company. The intent of this thermal aging testing is to establish long term reliability data for printed wiring board (PWB) materials for use in applications that require 20+ years (100,000+ hours) of operational life under different thermal conditions. Underwriters Laboratory (UL) testing only addresses unclad laminate (resin and glass) and not a fabricated PWB that undergoes many processing steps, includes copper and plated through holes, and has a complex mechanical structure. UL testing is based on a 5000 hour expected operation life of the electronic product. Therefore, there is a need to determine the dielectric breakdown / degradation of the composite printed circuit board material and mechanical structure over time and temperature for mission critical applications.
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: 3+ years experience in electronic manufacturing; with SMT new product introductions. Strong DFM experience. Duties/Functions: Provide DFM input to all new products. Interface with design and sustaining engineering to ensure ro
Technical Library | 2018-04-05 10:40:43.0
The miniaturization of microchips is always driving force for revolution and innovation in the electronic industry. When the pitch of bumps is getting smaller and smaller the ball size has to be gradually reduced. However, the reliability of smaller ball size is getting weaker and weaker, so some traditional methods such as capillary underfilling, corner bonding and edge bonding process have been being implemented in board level assembly process to enhance drop and thermal cycling performance. These traditional processes have been increasingly considered to be bottleneck for further miniaturization because the completion of these processes demands more space. So the interest of eliminating these processes has been increased. To meet this demand, YINCAE has developed solder joint encapsulant adhesives for ball bumping applications to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. In this paper we will discuss the ball bumping process, the reliability such as strength of solder joints, drop test performance and thermal cycling performance.
Used SMT Equipment | SMT Equipment
we are looking for the juki 2050 machine,if you have the machine,please contact me,thanks!!
Used SMT Equipment | Pick and Place/Feeders
Looking for Fuji CP643ME, please contact me if have any for sale.
Used SMT Equipment | Pick and Place/Feeders
FUJI CP6 FEEDER 8X2 MM PAPER 7 INCH BACK PLATE FUJI ORIGINAL 65 EACH IN STOCK ALL IN EXCELLENT CONDITION
Used SMT Equipment | X-Ray Inspection
X-Tek X-Ray Controller type SR2 ALCATEL ATP 80 UF160/0 Removed from service fully functional Do NOT have manuals
Used SMT Equipment | Pick and Place/Feeders
Block Level: P018 Software: 4.5.0 Sup E
