Industry News: 105 (Page 7 of 15)

Krayden Introduces Dow Corning's 702 Diffusion Pump Fluid for Large Volume Production

Industry News | 2010-12-09 13:10:47.0

Krayden introduces Dow Corning's 702 Diffusion Pump Fluid, designed for high vacuum and fast pumping of large volumes of gas or vapor in production.

Krayden Inc.

Polyonics Tapes Protect Components From Harsh Environments

Industry News | 2011-10-03 14:26:46.0

Polyonics has introduced a family of temperature and chemical resistant tapes that remain dimensionally stable in extreme manufacturing environments including ultra-high temperatures up to 500°C.

Polyonics, Inc.

SMART Group to Present Advanced PoP Webinar

Industry News | 2012-02-15 19:16:37.0

SMART Group will host a Webinar titled “Package on Package (PoP) Assembly Process & Inspection” on Thursday March 15, 2012 from 2:30-3:30 p.m. GMT.

The SMART Group

New High Thermal Conductivity LED Die Attach Adhesive for Small Die and LEDs from Engineered Material Systems

Industry News | 2013-09-05 20:26:22.0

Engineered Material Systems , a leading global supplier of electronic materials for circuit assembly applications debuts its CA-195 High Thermal Conductivity, Low Cost Electrically Conductive LED Die Attach Adhesive for attaching LED and other small semiconductor die to silver and copper lead frames.

Engineered Materials Systems, Inc.

Indium Corporation's SACM™ Provides Superior Drop Shock Performance AND Thermal Cycling Reliability

Industry News | 2013-11-01 13:11:17.0

Indium Corporation's new SACM™ is a high-reliability solder alloy that offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling – all at a cost below that of typical SAC solder alloys.

Indium Corporation

Indium Corporation Wins Global Technology Award

Industry News | 2013-11-14 18:14:55.0

Indium Corporation was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12.

Indium Corporation

Indium Corporation Features SACm™ at NEPCON China

Industry News | 2014-04-03 13:47:58.0

Indium Corporation will feature SACm™ solder paste at NEPCON China April 23-24 in Shanghai, China.

Indium Corporation

FSInspection Announces Winner of PKMag® 50 Giveaway

Industry News | 2015-03-12 11:13:20.0

FSInspection is pleased to announce the winner of the PKMag® 50 Portable Inspection Device giveaway held during the recent IPC APEX EXPO. A new PKMag 50 will be shipped to Jason Sciberras of Saline Lectronics, based in Saline, MI.

FSInspection

Engineered Material Systems Debuts CA-180 Low-Temperature Cure Conductive Adhesive

Industry News | 2015-05-04 16:04:54.0

Engineered Material Systems introduces its newest conductive adhesive – CA-180. The low-temperature cure conductive adhesive has been designed for die attach and general circuit assembly applications.

Engineered Materials Systems, Inc.

KDPOF Enables Seamless Optical Networks Integration

Industry News | 2018-02-22 06:49:37.0

Plastic Optical Fiber Gains Ground for Gigabit Ethernet Connectivity in Vehicles

KDPOF


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