New SMT Equipment: 2015 achieve (Page 7 of 42)

ABB T7S 1000 Sace PR232/P 1000A One year warranty

ABB T7S 1000 Sace PR232/P 1000A One year warranty

New Equipment | Components

▶Contact :Jim(Sales Manager) ★Mobile(WhatsApp): 86-18020776782 ★Email: sales6@amikon.cn ★Skype:live:sapphire_264 Promiss 100% full New - Original Factory Seal Warranty: 12 months Package: Original packing with cartons Payment Term: 100

Xiamen Carnation Technology Co., Ltd

TI New and Original TMS320VC5509APGE  in Stock  IC LQFP144, 2015+      package

TI New and Original TMS320VC5509APGE in Stock IC LQFP144, 2015+ package

New Equipment | Board Handling - Conveyors

TI New and Original TMS320VC5509APGE  in Stock  IC LQFP144, 2015+      package TMS320VC5509APGE  The TMS320VC5509A fixed-point digital signal processor (DSP) is based on the TMS320C55x DSP generation CPU processor core.  Today's Hot Deals:  TCD2

Shenzhen Fuwo Technology Co.,Ltd

Bonding Wire

Bonding Wire

New Equipment | Components

Gold / Aluminum / Copper Bonding Wires The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extr

Plastlist Group

Siemens 6DD1688-0AE2

Siemens 6DD1688-0AE2

New Equipment | Industrial Automation

Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD Our services  Packing & Delivery 1)100% full New! - Original Factory Seal ! 2)Warranty: 12 m

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Yamaha Flip Chip Bonder & Hybrid Placer

Yamaha Flip Chip Bonder & Hybrid Placer

New Equipment | Pick & Place

http://www.flason-smt.com/product/Yamaha-Flip-Chip-Bonder-and-Hybrid-Placer.html Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product des

Flason Electronic Co.,limited

Yamaha Flip Chip Bonder & Hybrid Placer

Yamaha Flip Chip Bonder & Hybrid Placer

New Equipment | Pick & Place

http://www.flason-smt.com/product/Yamaha-Flip-Chip-Bonder-and-Hybrid-Placer.html Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product descrip

Flason Electronic Co.,limited

Yamaha Flip Chip Bonder & Hybrid Placer

Yamaha Flip Chip Bonder & Hybrid Placer

New Equipment | Other

Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product description: Yamaha Flip Chip Bonde,Hybrid Placer, Yamaha flip chip bonding,Yamaha die bond, Yamaha

qismt electronic co.,ltd

General Electric IC697ALG321 Analog Input

General Electric IC697ALG321 Analog Input

New Equipment | Industrial Automation

Sales Manager: Sandy Lin Email: unity@mvme.cn Skype:onlywnn_1  Mobile(Whatsapp): (+86)-18020776786 ​​​ Yuehang:  Shipping Term : TNT,DHL,FEDEX,ETC Payment Term : T/T Warranty: 12 month yuehang supply: New+original+factory sealed+high quality

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Honeywell 51204033-005     MU-KFTS05   FTA Cable 5m CE

Honeywell 51204033-005 MU-KFTS05 FTA Cable 5m CE

New Equipment | Industrial Automation

Select the right products & services to meet your needs! PLeases contact us Email:unity@mvme.cn Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Product: Quali

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

CAT90-SA Semi Automatic Pick and Place System

CAT90-SA Semi Automatic Pick and Place System

New Equipment | Pick & Place

The CAT90-SA pick and place systems are semi-automatic machines featuring software guidance and the latest high resolution vision technology. Systems are designed for placement of various SMT components such as capacitors, resistors, SOIC’s, fine-pit

Advanced Techniques US Inc. (ATCO)


2015 achieve searches for Companies, Equipment, Machines, Suppliers & Information