Industry News | 2017-08-14 18:22:34.0
The SMTA Capital Chapter is pleased to announce that Shannan O’Shaughnessy of GVD Corporation, will present “Reliability without Hermeticity: Commercial Vapor Deposited Coatings for High-Frequency RF Micro-Electronics” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.
Industry News | 2016-08-17 21:07:09.0
Nordson ASYMTEK will present the paper Advanced Dispense Solutions for Hand-held Devices, at China Mobile Manufacture Forum (CMMF) on August 25, 2016. In addition, they will be exhibiting the latest in jet dispensing and conformal coating technologies in booth #1H20 at NEPCON South China, August 30-September 1, 2016 at the Shenzhen Convention & Exhibition Center, Shenzhen, China.
Industry News | 2010-09-22 15:01:40.0
Removing heat has become a major issue in the electronics industry as more highly integrated devices are jammed into less space and as high power devices, such as LEDs, become increasingly more common.
Industry News | 2012-08-02 11:47:58.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 9th Annual International Wafer-Level Packaging Conference.
Industry News | 2023-08-01 06:13:48.0
Industrial control applications play a vital role in modern manufacturing processes, ensuring precision, efficiency, and reliability in diverse industries. Two significant electronic assembly technologies, Surface Mount Technology (SMT) and Through-Hole Technology (THT), have long been used independently in the manufacturing sector. However, with the continuous evolution of technology, the integration of SMT and THT industries has emerged as a powerful trend, driving innovation, and offering new possibilities for industrial control applications. In this article, we will explore the synergies between SMT and THT, showcasing how their combination enhances industrial control solutions, making manufacturing processes smarter, faster, and more versatile.
Industry News | 2011-07-20 14:49:09.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 8th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 3-6, 2011 at the Santa Clara Marriott Hotel in Santa Clara, California
Industry News | 2012-12-14 06:50:53.0
e IPC APEX EXPO® Technical Conference will cover two dozen technical topics in the areas of board fabrication, design and electronics assembly.
Industry News | 2009-12-17 18:14:12.0
Minneapolis, MN - The SMTA and Chip Scale Review magazine are pleased to announce the Best of Conference Paper from the 6th Annual International Wafer-Level Packaging Conference and Exhibition, which was held October 27-30, 2009 at the Marriott Hotel in Santa Clara, California. After review by members of the 2009 IWLPC Technical Committee, In-Soo Kang (NEPES Corporation) has been selected as the Best of Conference award winner for his technical paper on "Development of Wafer Level Package of Normal and High Pin Count Devices for Mobile Applications."
Industry News | 2013-07-19 11:27:23.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 10th Annual International Wafer-Level Packaging Conference.
Industry News | 2014-12-04 17:21:34.0
IPC APEX EXPO 2015 will feature Robbie Bach, former president of entertainment & devices at Microsoft, Xbox visionary and civic activist, as the opening keynote presenter on Tuesday, February 24, 2015. Bach will present, “The Xbox Story: Lessons in Strategy, Team Management and Entrepreneurship.”
