Electronics Forum | Tue Aug 26 09:33:04 EDT 2008 | wavemasterlarry
If this board is waved soldered than you may want to look at the wave causing the BGA to reflow a 2nd time when it goes over the wave. The board bows down and the the joint liquidfies and then hardens before the board fully goes back to flat which c
Electronics Forum | Wed May 06 15:05:00 EDT 1998 | Justin Medernach
| | Dear Freinds, | | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOX
Electronics Forum | Thu Jun 17 09:50:27 EDT 1999 | Brian Wycoff
| | WOULD LIKE TO DO RELOW OF 2 SIDED SMT BOARDS. USUALLY THE BOTTOM SIDE HAS RESISTORS AND CAPS ONLY. WHEN THE BOTTOM OF THE BOARD HEATS UP, THE PARTS ARE FREE TO MOVE AND ONLY SURFACE TENSION WILL KEEP THE COMPONENT FROM FALLING OFF. | | CAN BOARDS
Electronics Forum | Wed May 06 19:51:46 EDT 1998 | D.Lange
| Dear Freinds, | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOXY DI
Electronics Forum | Wed Mar 15 13:35:40 EDT 2017 | scotceltic
I have a double sided PCBA setup. I have MSL components on both assembly sides. When I run Assy Side one I am within the allotted hours remaining on the MSL component. I then wait 40 hours before running 2nd Assy side. By then the hours on the 1s
Electronics Forum | Fri Jun 02 09:31:26 EDT 2000 | C.K.
Okay, there's a debate here at my company. We build a card here that, often times, we get batches where there is excess HASL in the VIA hole barrels. Here is the problem that this causes: During the "1st reflow", the excess HASL bleeds out of the
Electronics Forum | Thu Jun 29 11:08:55 EDT 2000 | Dave F
Kok Han: Good to hear from you. Please help us understand you situation better by talking more about: � Component IC of the RF unit (IC101). For instance: SMT / PTH, package, pitch, lead material, lead finish, package type, package weight, coplan
Electronics Forum | Sun Feb 13 19:04:13 EST 2000 | Jackie Hsieh
First I'm a Taiwanese people so excuse my bad english writing. On my experience, The process of double side SMT procedure with two methods ---First one is appling the glue on the solder side, and placeing the R,C,L chips components on it.and 2nd one
Electronics Forum | Thu Oct 28 04:52:27 EDT 1999 | Paul Gerits
Hi Jerry, normal proces would be; 1st. reflow side (top) 2nd. curring side (bottom) 3rd. insert 4th. solderwave Reason for this is that you have a better handling and no overdue stress to components in case you do bottom before top. It is also eas
Electronics Forum | Thu Mar 11 12:05:22 EST 2004 | russ
the ones we use have a temp adjust/control. To answer reflowing adjacent components we reflow them during the rework. However if we do not want to reflow we either change the tip on the gun to a more localized area or we apply temporary mask to pre
.gif)
