Electronics Forum | Mon Dec 30 12:55:37 EST 2019 | emeto
We saw your profile, which in my opinion looks alright based on the guideline from the vendor. Can you tell us more about the joints that you cleaned? Are they showing nice wetting and nice and shiny finish? How about your stencil thickness? From my
Electronics Forum | Tue Aug 24 23:04:14 EDT 2004 | pdeuel
If this code is on a ceramic cap then it is a 0.1uf cap. We have a conversion charts that list most all codes. Useing the last 2 digets only determine the value. The capatol letters A thru Z are given specfic numerical value. Example A0 is 1.0pf, A1
Electronics Forum | Mon May 17 16:34:25 EDT 2004 | pjc
I am an equip mfrs rep. I took a customer to my wave solder principal's factory to run their boards on a wave with no-Pb alloy, (Sn96.5 Ag3.0 Cu0.5) in air environment. The results were excellent with pot temp of 263C (505F). Their boards are low to
Electronics Forum | Tue Mar 15 22:04:56 EST 2005 | KEN
The hasl joint looks fuller (and is easier to inspect)because it has more solder volume. Think about it. Your pre-plating your board with solder (before you add more solder). I doubt your getting 0.3 mils of hasl.....probably more like 1.3 to 3.0
Electronics Forum | Fri Feb 16 09:30:38 EST 2007 | DEK Answer Guy
Hello PR, PumpPrint� technologies enable high throughput adhesive deposition using a screen printing platform. Careful selection of stencil material, and informed study of the design of apertures and other stencil features, enables a wide range of
Electronics Forum | Fri Oct 01 06:45:36 EDT 1999 | JAX
| Hi, | | We are running 0402 component on the TCM1000 and we find that teher will be missalignment on 0402 Capositor. We have identified that the missalignment is caused by the wrong information from the vision system while doing vision centering.
Electronics Forum | Fri Oct 01 07:25:05 EDT 1999 | Wolfgang Busko
| | Hi, | | | | We are running 0402 component on the TCM1000 and we find that teher will be missalignment on 0402 Capositor. We have identified that the missalignment is caused by the wrong information from the vision system while doing vision cente
Electronics Forum | Tue Dec 17 12:53:28 EST 2002 | russ
You looked one page to far in the IPC book! Fillet height of 75% is acceptable for all 3 classes. Per IPC 610 rev. C Section 6 table 6.2. A. Circumferential wetting on Primary side (top)between lead and barrel (not anualar ring) Class 1 Not spe
Electronics Forum | Thu Apr 05 12:25:17 EDT 2001 | Adam
The Solderballs are on the botton side of the board.The solderballs are concentrated around through hole edge connectors, which have a Tin/lead finish and have lead pitch of 2.5mm, on top of this, random solderballs are occuring around test points. T
Electronics Forum | Wed Oct 28 19:45:33 EST 1998 | Ron Gilman
I will try to answer some of your questions. My name is Ron Gilman and I am President of Chipscale Robotics here in Fremont California. We manufacture Die Pick & Place equipment and would be happy to send you brochures. Please email me with your a
