Electronics Forum: 60 c baking (Page 7 of 68)

Questions on J-STD-033A procedure (Table 4-1)

Electronics Forum | Wed Feb 15 19:27:24 EST 2006 | CW

Reviewing the J-STD-033A procedure and try to better understand Table 4-1 ... There are 3 columns for Baking Temperature & recommended Duration ... 1st one is for 125C, then for 90C, then followed by 40C ... it also specify the environmental condi

second side reflow of MSD parts after wash

Electronics Forum | Wed Mar 24 16:54:38 EDT 2010 | stepheniii

J-STD-033B.1 Says "For cavity packages in which water may be entrpped, water clean processes after first reflow can be an additional source of moisture. This may present an additional risk, which should be evaluated." And it talks about derating if

MSL | Baking components after expired floor life

Electronics Forum | Tue Sep 13 14:10:13 EDT 2022 | emeto

You can have a dry cabinet with or without heater. They use desiccants to take the humidity out from the parts. As you can imagine it will be a lengthy process. The ones with heater can do 40C, which will be preferred for plastic and paper tapes. I w

Remove,Re-ball then Re-use BGA safely !!!

Electronics Forum | Tue Jul 02 09:29:08 EDT 2002 | dason_c

Ian, First, I baked the parts at 125C for 48 hours and check the weight Second, I soaked the parts above 30C and 60% for 96 hours and check the weight Calculate the weight gain, suppose only moisture add to the parts during soaking, say a Third, dry

Pb Drying / Degassing PWB

Electronics Forum | Sat Nov 22 09:27:18 EST 2008 | davef

IPC-HDBK-001 w/Amendment 1 Handbook and Guide to Supplement J-STD-001 (Includes J-STD-001B to C Comparison). During fabrication and storage, both components and PWBs will often absorb water. If left in the device, this water will vaporize at solderi

Re: Humidity Control

Electronics Forum | Mon Nov 27 12:17:02 EST 2000 | Dason C

Chris, you are not completely right. Our industrial is following the IPC standard as our guideline. Per IPC J-STD-033 has specify the floor life at para. 8 (normal condition at 30C/60%RH). If Victor can control his environment at 32% then the compo

Floor life pcb assembly

Electronics Forum | Wed Apr 23 19:00:39 EDT 2008 | stevek

It depends on the laminate but a PWB is like any other MSL component. Some fab shops are only waranting standard FR4 laminates for 45-60 days when processed at lead free temperatures. The best thing I can say is to try some weight gain/loss experim

Moisture Sensitive Devices

Electronics Forum | Wed May 05 14:37:58 EDT 2004 | Gaz

I'm not in production, but I do repairs by replacing CSP & LGA components on PCB's. Our components are supplied sealed in packs of 5 with a humidity indicator card and desiccant. I recently failed an audit by the company I do the work for because th

dry oven

Electronics Forum | Wed Aug 14 13:54:54 EDT 2002 | DenM

Larry, You can try one of two approaches, a bake above 100C will drive off moisture or use a vacuum bake. The vacuum bake process is slow since there is less/no air to conduct the heat. In the hybrid industry the standard vacuum bake was 16 hours at

BGA Baking in Reels?

Electronics Forum | Fri Feb 01 15:09:43 EST 2008 | chef

Don't do it.!!!! Are you nucking futs? Why is pre-bake required? Are you producing in high humidity? Is the package of the device poroues enough to suck in moisture? Think, consider you will not get an even "bake", the outside of the reel will get


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