Electronics Forum | Fri Jan 11 06:28:40 EST 2019 | tirthkar8980
what is solder flux? what contents are used for manufacturing solder flux for solder sn/Pb 63/37 ( Application Wave Solder machine )
Electronics Forum | Sat Jan 19 04:50:48 EST 2019 | tirthkar8980
why two high melting temperature metals are getting melt earlier or mean at very low temperature after mixing. Ex :- Tin (sn) - 231 C melting point lead (pb) - 327 C melting point But Sn/Pb - 63/37 melting temperature is 183 C
Electronics Forum | Fri May 18 10:56:09 EDT 2007 | patrickbruneel
Hi smtnetters, I�m looking for reference material preferably graph�s displaying the viscosity and surface tension vs. temperature for standard Sn63 Pb37 alloy. Plenty of reference material is available on pure metals but can�t find anything on the
Electronics Forum | Tue Nov 11 02:36:56 EST 2003 | Henry Lee
Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a
Electronics Forum | Wed Nov 12 20:24:45 EST 2003 | Henry
Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a
Electronics Forum | Tue Oct 03 16:55:26 EDT 2000 | Chris
Does anyone have any recomendations for a NC flip chip attach flux? I have info from Indium and Kester. Who else makes a good flux for flip chip. I will be dispensing this flux using a doctor blade and rotating disk. I will then dip the flip chip
Electronics Forum | Mon Mar 27 08:28:48 EST 2000 | Mark Alder
Dear Robert The reason for the bridging problem you are experiencing on your BGA's is due because of too much solder. The PCB pads need to be at least 15% larger than the sphere size of the BGA balls. If you are not using C4 (63/37) BGA spheres and
Electronics Forum | Fri Aug 30 04:53:08 EDT 2002 | jason
Hi Dr Lee, Recently, I was assigned to use Ag imm. PCB using 63/37 solder paste without Ag. The results were not fantastic. Surface finish was rough and lots of wetting issue. The oven profile soaking time was set at 70 secs above 183�C and Max tem
Electronics Forum | Tue Jun 06 14:31:42 EDT 2000 | Jeff Sanchez
I have 25#'s of bismuth in my shop. I wanted to add some to my 63/37 till it was eutectic. This would allow me to lower the waves temp. Can I do this and still meet standards? Also would it make the solder joints to brittle and would discoloration be
Electronics Forum | Mon Dec 06 09:16:22 EST 1999 | Dave F
Russ: Three things: 1 Wolfgang is 100% correctamundo about the slow dissolution rate of gold 2 Shear stength of the gold 63/37 solder connection decreases rapidly, as the gold content of the solder connection increases above 2%. 3 There are many
