Full Site - : adding and solder and to and bga (Page 7 of 17)

Machine Vision Products to demonstrate Supra E AOI and Microelectronics inspection capabilities at Nepcon China 2012

Industry News | 2012-04-24 06:53:22.0

April 24, 2012.Machine Vision Products (MVP), a leader in Automated Optical Inspection, will be demonstrating their latest Supra E and Ultra 850G Microelectronics AOI at Nepcon China in Shanghai from April 25th to April 27th. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 18 years of service to the industry. MVP will be exhibiting at Stand 1C65.

Machine Vision Products, Inc

Nihon Superior to Present at the TMS 2008 Annual Meeting and Exposition

Industry News | 2008-03-05 22:38:31.0

OSAKA, JAPAN � March 5, 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry, announces that it is contributing a paper, titled �High Impact Strength Tin-Copper Based Lead-free Solder Bump Alloys� authored by Tetsuro Nishimura, Shoichi Suenaga and Keith Sweatman, to the Technical Conference that is part of the TMS 2008 Annual Meeting and Exposition scheduled to take place March 9-13, 2008, in New Orleans, Louisiana.

Nihon Superior Co., Ltd.

STI to Exhibit One-Stop Contract Manufacturing and Training Services at SMTAI

Industry News | 2014-08-27 21:23:28.0

STI Electronics, Inc. announces that it will exhibit in Booth #412 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.

STI Electronics

Digicom Electronics Incorporates Nitrogen in Soldering and Reflow Processes to Maximize Device Reliability

Industry News | 2016-10-06 10:10:53.0

Digicom Electronics now generates its own nitrogen to use in its solder reflow, selective soldering, and hand soldering manufacturing processes to strengthen the bonds and improve solder adhesion. Adding nitrogen minimizes device failure and ensures printed circuit board integrity, especially for mission critical products for the medical, military and aerospace, industrial, and RF wireless industries. The addition of nitrogen is part of Digicom's Diamond Track Manufacturing Processes.

Digicom Electronics

Kester to Exhibit Leading Fluxes, Pastes and Wires at SMTA Atlanta

Industry News | 2009-04-13 16:23:27.0

ITASCA, IL � April 2009 � Kester announces that it will exhibit leading fluxes, pastes and wires at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.

Kester

MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Dallas and Houston Expo & Tech Forums

Industry News | 2011-02-17 14:59:07.0

MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming SMTA Dallas and Houston Expo & Tech Forums. The SMTA Dallas Expo & Tech Forum is scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX and the SMTA Houston Expo & Tech Forum is scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.

Finetech

MARTIN to Demonstrate Affordable Rework System and Mini-Oven Reball/PreBump Unit at SMTAI 2011

Industry News | 2011-09-19 16:30:56.0

MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system in Booth #407 at the upcoming SMTA International Conference & Exhibition.

MARTIN (a Finetech company)

Machine Vision Products to demonstrate Supra E AOI and Microelectronics inspection capabilities at Nepcon China 2011

Industry News | 2011-05-11 18:59:27.0

May 11, 2011 Machine Vision Products (MVP), a leader in Automated Optical Inspection, will be demonstrating their latest Supra E and Microelectronics inspection capabilities at Nepcon China in Shanghai from May 11th to May 13th. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 18 years of service to the industry. MVP will be exhibiting at booth 4E23 Level 1B East Hall.

Machine Vision Products, Inc

MacDermid Alpha to Launch ALPHA HiTechHigh Tg, Low CTEUnderfill and CornerfillBonding Materials

Industry News | 2021-01-17 17:50:26.0

The Assembly Division of MacDermid Alpha Electronics Solutions announces the release of ALPHA HiTechUnderfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.

MacDermid Alpha Electronics Solutions

TechSystems to Represent EVS Solder Recovery Systems in Northern CA and NV

Industry News | 2022-03-17 07:30:21.0

EVS International is pleased to announce that it entered a new manufacturers' representative agreement with TechSystems. Under the agreement, Chris Putney, President of TechSystems, will represent EVS' solder recover systems throughout Northern California and Western Nevada.

EVS International


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