New Equipment | Solder Materials
With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a
Industry News | 2013-04-08 19:29:43.0
AIM Solder will highlight its new NC259 Solder Paste in Booth #1A26 at NEPCON China 2013, scheduled on the 23rd - 25th of April, 2013 at the Shanghai World EXPO Exhibition & Convention Center.
Industry News | 2015-01-27 10:59:31.0
The Balver Zinn Group announces that Cobar Solder Products Inc. is sponsoring the fourth annual IPC APEX EXPO® Hand Soldering Competition, scheduled to take place Feb. 26, 2015 at the San Diego Convention Center in San Diego, CA. Cobar Solder Products is contributing Balver Zinn’s BRILLIANT B2012 SAC305 (SN97C) solder wire is halide-free, rosin-based and designed for manual and robotic soldering.
Industry News | 2008-03-01 17:46:50.0
Breda, Holland -- Cobar BV, a member of the Balver Zinn Group, announces the introduction of XF3 lead-free solder paste, developed to accommodate extended reflow profiles without the use of nitrogen. XF3 completes the family of Cobar products based on Nihon Superior�s patented SN100C-alloy.
Industry News | 2008-03-10 14:49:28.0
Breda, Holland -- Cobar BV, a member of the Balver Zinn Group, announces the introduction of XF3 lead-free solder paste, developed to accommodate extended reflow profiles without the use of nitrogen. XF3 completes the family of Cobar products based on Nihon Superior�s patented SN100C-alloy.
Industry News | 2008-03-25 23:59:52.0
Comment from Tetsuro Nishimura, North American Sales Manager
Technical Library | 2018-05-17 11:14:52.0
Intermetallic compound (IMC) growth is being studied in earnest in this past decade because of its significant effect the solder joint reliability. It appears that from numerous investigations conducted, excessive growth of IMC could lead to solder joint failure. Leading to this, many attempts has been made to determine the actual IMC thickness. However, precise and true representation of the growth in the actual 3D phenomenon from 2D cross-section investigations has remained unclear. This paper will focus on the measuring the IMC thickness using 3D surface profilometer (Alicona Focus G4). Lead free solder, Sn3.0Ag0.5Cu (SAC305) was soldered onto copper printed circuit board (Cu PCB). The samples were then subjected to thermal cycle (TC) storage process with temperature range from 0 °C to 100 °C for 200 cycles and up to 1000 cycles were completed.
Industry News | 2008-08-07 15:26:07.0
Nihon Superior will feature a new, expanded range of SN100C products with FCT Assembly, one of its US SN100C Global Partners, in booth 125 at the upcoming SMTA International exhibition and conference.
Industry News | 2013-01-15 16:31:41.0
– AIM Solder announces that it will highlight its new NC277 No-Clean Liquid Flux at the upcoming IPC APEX Expo,
Industry News | 2012-01-20 15:08:03.0
AIM will debut its new NC259 Solder Paste chemistry in Booth #2804 at the upcoming IPC APEX Expo.
