Full Site - : aperture shape (Page 7 of 23)

0402 pad and stencil aperture design

Electronics Forum | Thu Oct 30 22:29:58 EDT 2008 | davef

For most applications, a nice square [or rectangle] pad works just fine. Assemblers ship boat loads of boards with these every day. It's reasonable for tight decoupling capacitor requirement applications to use round or radiused pads for components

0201 Land Pattern and Aperture Shape Design

Electronics Forum | Wed Mar 09 19:51:28 EST 2005 | KT

Greetings: I would like to know the common land patterns and aperture shapes that are currently in use. We are doing some research on the same. Please respond to the thread if you have a success story with you current design. Thanks KT

0201 Land Pattern and Aperture Shape Design

Electronics Forum | Thu Mar 10 14:31:56 EST 2005 | KT

Thanks for the info. Appreciate it.

pasteprinting D.O.E.

Electronics Forum | Tue Jun 04 22:46:21 EDT 2002 | davef

Factors to consider are: * Squeegee speed * Squeegee pressure * Separation speed * Stencil thickness * Stencil aperture fabrication method * Stencil aperture shape * Paste type * Stencil under-wipe frequency Search the fine SMTnet Archives for a thr

CCGA

Electronics Forum | Sun Apr 03 00:40:35 EST 2005 | Dhanish

What is the recommended stencil aperture opening ,stencil thickness and aperture shape for CCGA?We are seeing high reject for Open solder joint.

LGA Processing

Electronics Forum | Thu Mar 29 21:47:41 EDT 2007 | davef

PCB land to part land ratio - 1:1 Stencil aperture size - 1:1 with PCB land Stencil aperture shape - same as PCB land

solder balls

Electronics Forum | Thu May 06 10:28:27 EDT 2004 | Bryan She

Modify your stencil aperture shape...reduce the solder paste deposited on pad,will reduce the solder balls.Be sure your reflow profile are good before doing this.rising slope is very important. This is my opinion.thanks. Bryan

0201 Land Pattern and Aperture Shape Design

Electronics Forum | Thu Mar 10 07:11:56 EST 2005 | py (france)

Hi, see below.. http://www.omnigraph.com/index1.html?content=/subpages/review.html

solder balls

Electronics Forum | Mon Jul 16 14:48:16 EDT 2001 | mparker

Just received "Circuits Assembly", July 2001 issue. An article regarding solder balls and aperture design, beginning on page 40. This DOE had aperture, reflow profile and no clean pastes (3 types) as attributes. It is advocated that a U-shaped a

Re: SHEESH!

Electronics Forum | Fri Jul 24 01:28:00 EDT 1998 | Alex Ondi

I also heard of a company considering a patent on aperture design. The aperture was a "chevron" aperture, very similar to the "V" shaped aperture recently touted in SMT magazine, presumably for the purpose of reducing solder balls. Go figure!


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