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SMT 2013 Preview for Market Leader AdoptSMT for Print Media Hall 7, booth 100

Industry News | 2013-03-27 15:19:20.0

Showcasing its products at SMT 2013 trade fair in Nuremberg, AdoptSMT Europe will continue to focus on its fast growing second core segment of spare parts, tools and consumables offering its customers new products and innovative solutions.

AdoptSMT Europe GmbH

Preview for AdoptSMT for SMT 2018, Stand A4-458 We keep your production running -

Industry News | 2018-04-17 13:09:58.0

Market Leader AdoptSMT will showcase at SMT 2018 an array of new and updated innovative products. Again these products and the service AdoptSMT offers their customers make AdoptSMT’s slogan become true: We keep your production running. AdoptSMT covers the processes of PCB assembly, hand soldering and industrial identification. We are proud to present many new products like the Thermaltronics Solder Robot with offset correction by vision system and laser height measurement, the AdoptSMT Premium Solder Preforms or late model pre-owned machines in stock - while we still want to give an overview over our complete range of products and services.

AdoptSMT Europe GmbH

Dispenser Bound for Chinese Technology Centre

Industry News | 2003-05-29 08:13:34.0

Universal Instruments and Asymtek have formed a partnership that will place an Asymtek Millennium 2020 dispenser in Universal's new Technology Excellence Centre in Suzhou, China.

Universal Instruments Corporation

Preview for Pickering Electronics productronica 2013

Industry News | 2013-10-28 14:05:08.0

Visit us at Hall A1.452 where you will see our range of 3V Reed Relays which supplement our already wide range of high quality Reed Relays for Instrumentation and ATE.

Pickering Electronics

PEM® Fasteners for Printed Circuit Board Applications

Industry News | 2016-10-25 11:49:23.0

Enable Secure and Reliable Attachment Using Minimal Hardware Several dedicated families of PEM® fasteners from PennEngineering® enable secure and reliable attachment for a wide range of printed circuit board applications. Depending on type and style, these fastener solutions can satisfy component-to-board, board-to-board, board-to-chassis, or stacking or spacing attachment challenges. They offer practical alternatives to loose hardware and other joining methods, install permanently without secondary operations, and ultimately can simplify and streamline assembly.

PennEngineering

Altus Offer Energy Saving Solutions for Soldering

Industry News | 2022-09-26 06:44:01.0

The rising cost of energy is putting a strain on everyone, including those within the electronics industry. As wholesale gas and electricity prices continue to rise, finding solutions to reduce consumption is now a top priority for companies.

Altus Group

Scienscope launches new rental/rent-to-own program for AXC-800

Industry News | 2018-07-02 22:09:54.0

Scienscope International today announced that it has launched a new rental/rent-to-own program for the AXC-800 X-ray table top component reel counter. This program has been launched in response to customer requests, and offers customers the ability to rent a system without any major capital outlay.

SCIENSCOPE International

Scienscope Announces X-ray Lineup for productronica

Industry News | 2017-10-17 19:51:55.0

Scienscope International announced plans to exhibit in Hall A1, Booth 402 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München in Germany. Company representatives will demonstrate the X-Scope 2000 X-ray Inspection System, X-SPECTION 6000 X-ray Inspection System and AXC-800 X-ray component reel counter.

SCIENSCOPE International

Speedprint Appoints VP for the Americas

Industry News | 2011-04-25 11:39:29.0

Speedprint, part of the Blakell Europlacer Group, announces the appointment of Mark Brawley to the position of VP Speedprint Americas.

Speedprint Technology

Call for papers - EIPC Summer Conference

Industry News | 2008-02-04 11:15:15.0

The European Institute of Printed Circuits (EIPC) extends an invitation to companies and individuals active in the Packaging and Interconnection Industry to submit abstracts for presentation at their Summer Conference which is to be held onMay 29 & 30 2008 in Dresden, Germany.

European Institute of Printed Circuits-EIPC


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