Electronics Forum: bake out (Page 7 of 40)

Re: Reflow Profile Dry Out Stage

Electronics Forum | Wed Dec 13 14:37:06 EST 2000 | Chris

I should explain that this bake out was performed after population. The solder paste slumped terribly after this bake out. However, after the back out and after reflow, no bridging.

component baking process

Electronics Forum | Mon Sep 20 16:06:53 EDT 2004 | blnorman

We require that the ovens used for bake out are vented, thus removing the vapor from the oven.

Electronic Assemblies Manufactuirng - Bake-out ramp rate

Electronics Forum | Fri Feb 09 09:42:33 EST 2018 | jmedernach

I completely agree. J-STD-033 spells out the "how to" of baking, quite clearly. You have to bake something for an expensively long time at 80 - 85C in order to properly desiccate your components.

MSD Baking

Electronics Forum | Fri Feb 10 13:30:31 EST 2023 | rwyman

Yes, that point remains unchanged. Just a general comment that there have been updates. e.g. re: desiccant re-use, certain devices no longer requiring bake-out, or bake times have been adjusted, and more.

Electronic Assemblies Manufactuirng - Bake-out ramp rate

Electronics Forum | Tue Jan 30 01:06:51 EST 2018 | dgassier81

Hi, In our shop we've always baked out PCBs and moisture sensitive parts prior to electronic assembly using a gentle ramp rate of 2 degC/minutes going hot (93degC) and same ramp rate going cold (back to room temp). We're trying to outsource that pro

Military Lamina bake-out

Electronics Forum | Fri Aug 02 12:31:51 EDT 2002 | QuadTweeker1

What are some of the guidelines used by Industry professionals for all Lamina materials and layers?

Electronic Assemblies Manufactuirng - Bake-out ramp rate

Electronics Forum | Mon May 21 11:09:30 EDT 2018 | optimatech

Thank You for informing me :)

LGA voiding

Electronics Forum | Tue Jan 07 17:33:26 EST 2020 | SMTA-Norah

Were the boards baked out before soldering? Is there plated over vias in the pads?

PCB BAKING

Electronics Forum | Tue Mar 17 10:47:56 EDT 2020 | davef

IPC-1601 covers PWB bake-out, methods for determining optimum bake time and temperature, caveats for certain PWB plating finishes, etc. IPC-1601 is to bare boards as J-STD-033 is to components

PCB Delamination

Electronics Forum | Fri Jun 01 16:13:45 EDT 2012 | kahrpr

You also need to get with the PCB manufacturer. Their is a lot that can go wrong with that many layers. If the manufacture is trapping that much moisture. you may have a hard time baking it out. Dave and Graham are right about the time and energy. It


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