Electronics Forum: bare baking (Page 7 of 9)

Coating adhesion problems

Electronics Forum | Tue Sep 21 11:34:10 EDT 2004 | davef

Several things to check are: * Ask Multicore if their flux res and your conformal coat are compatible. Conformal coats and NC flux res are notorious for having compatibily issues. * Conformal coat a bare board to determine if there is there is enoug

Anyone facing QFN package crack problem ?

Electronics Forum | Wed Nov 28 16:08:38 EST 2007 | jmelson

I've been using Xilinx TQFP's in the 44 and 144 lead sizes with no trouble. I don't even bake them before reflow and have never had any problem. The Xilinx parts are certainly NOT sensitive, I could not break one with my bare hands if I tried (I ha

Pin hole

Electronics Forum | Thu Mar 11 02:56:01 EST 2010 | grahamcooper22

Hi, blow holes / pin holes / holes in joints are usually a sign that there is excess moisture somewhere around the solder joint. Moisture can be in pcbs / components, so try drying them....a simple thing to do is pass a bare pcb throught your reflow

Lead free selective solder

Electronics Forum | Thu Jun 29 12:07:09 EDT 2017 | georgetruitt

HOW THICK IS THE BOARD? IS THERE A LOT OF COPPER IN THE BOARD? DOES YOUR CUSTOMERS PROVIDE HEAT RELIEF IN THE BOARDS BARREL DESIGN THERE NEEDS TO BE PLENTY OF ROOM FOR LEADFREE SOLDER TO FLOW, DID YOU CHECK YOUR PIN(LEAD)TO HOLE (BARREL) RATIO? N

PCB Baking after Wash

Electronics Forum | Tue Dec 09 09:46:31 EST 2008 | lazzara55

SMT-ypw: Do you have information about IPC D-35 for reference? B3: The D-35 is a subcommittee responsible for developing industry guidelines on the proper handling, shipping and storage of printed boards and printed board assemblies. Moisture is a ma

Re: T sub g

Electronics Forum | Thu Jun 25 14:41:07 EDT 1998 | Earl Moon

| Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Handb

Re: T sub g

Electronics Forum | Fri Jun 26 11:27:12 EDT 1998 | Earl Moon

| | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Han

Re: T sub g

Electronics Forum | Fri Jun 26 15:37:50 EDT 1998 | Justin Medernach

| | | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection H

Flexi Circuits Assembly

Electronics Forum | Thu Feb 14 20:24:07 EST 2002 | scott

My first reaction would be to run! FAST! Flex -- well, it... flexes... and isn't flat. While you assemble it, While you transport it, While it goes through the oven... SMT Connectors typically need to be held down during reflow. Fiducial types are

Coating adhesion problems

Electronics Forum | Tue Sep 21 11:39:41 EDT 2004 | pabloquintana

Conformal coat a bare board to determine if there > is there is enough surface free energy from your > solder mask to prevent dewetting. Sorry for my ignorance, but what is "enough surface free energy"? How do I determine that? >* Bake a board


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