Electronics Forum | Fri Oct 06 08:22:05 EDT 2000 | jackofalltrades
BGA's are not difficult, but should be inspected no matter how careful you are. Here we have been doing bga's forever and x-ray 100%. Without an x-ray there is no good way to ensure the BGA is placed properly, without bridging or insufficients. If yo
Electronics Forum | Mon Jul 24 23:34:14 EDT 2000 | rzkr438
I am tyring to find out shear force requirement for BGA attached on board .I measured two group for shear force to check underfill process effectiveness on BGA .Two group showed siginificant force diferrence .I am very sure underfill process is effec
Electronics Forum | Sun Jun 24 05:03:20 EDT 2001 | ronih
Hello, I need some information about footprint of BGA / fine BGA. As far as I know the pad on PCB should be the same as the pad on the BGA (much smaller than the ball dia.). I need some information regarding the hole SMT process: - Paste printing:
Electronics Forum | Tue Feb 25 20:10:33 EST 2003 | davef
First, there is no standard. Next, on one hand, most BGA cost a lot of money. On the other hand, choosing to use reballed BGA in products for shipment depends on how well you expect to meet your customers' expectations about product reliability wit
Electronics Forum | Sun Mar 07 19:58:03 EST 2004 | praveen
Hello , Can any body help in solving the problem of PCB warpage during BGA rework. I am using IR heating system. No problem found in reworking BGA's size less than 30mmx30mm but for 35 mmx35mm and above BGA get solder short due to PCB warpage. Note
Electronics Forum | Fri Apr 16 04:19:28 EDT 2004 | denis_s
Hi, I've a problem with a BGA. I've the impression that the balls broke then there is a too big mecanical stress on the PCB. I lost some dBm and when I press on the BGA I measure the good value! It's like the balls are take off the BGA or PCB and wh
Electronics Forum | Mon Jan 16 10:59:25 EST 2006 | davef
Ken Tacky flux reworked BGA will be perfectly reliable in most customer use environments. We do not have data, but the tacky flux reworked BGA will be less reliable than a BGA reworked with paste [assuming all other factors are the same], because t
Electronics Forum | Mon Jul 10 12:07:20 EDT 2006 | CKH
Hi Folk, if i have already mounted a BGA ICs with Missing BGA Balls onto the board, what will the Missing BGA Balls look like in X-Ray (2D & 3D).... A Big Void or will it look the same as other BGA Balls? Appreciate your advice. Thks & Rdgs CKH
Electronics Forum | Tue Feb 27 20:42:56 EST 2007 | pyramus
Hi anybody have experience with the Package on Package BGA components. I mean BGA over a BGA component assembly. Our R&D is requesting us feedback for the future usage of this part. Need to gather some info on possible SMT issues for usage of this B
Electronics Forum | Thu Oct 25 04:58:58 EDT 2007 | wayne_
I think the not fully melted BGA ball is the main problem. The middle of the BGA IC...the ball not fully melted....when it subjected to heat and cause PCB warpage....the partial melted joint in the middle part of the BGA started to crack...bcos of we
