Electronics Forum | Mon Jan 22 20:54:55 EST 2001 | davef
IPC-7095 - Design & Assembly Process Implementation for BGA's Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. This document
Electronics Forum | Fri May 07 12:02:28 EDT 2004 | Dreamsniper
From my understanding paste on BGA pads are applied only to help in holding the component as the PCB is conveyed during the manufacturing process then soldered. But during rework on BGA's do I have to apply Solder Paste or just Flux? What's the diffe
Electronics Forum | Mon Nov 09 07:57:58 EST 1998 | Mark Quealy
| Does anyone know of a company that reballs BGA's? Im looking for a reliable source that can do a 10/90 alloy. | Winslow Automation in Cal. sells re-balling services as well as a line of preforms and fixtures to do it yourself. We've been re-ball
Electronics Forum | Thu Aug 23 13:29:07 EDT 2001 | morefun
Some of our other divisions have had to do epoxy underfill with BGA devices to obtain adequate reliability for aerospace applications. Are there any special layout considerations required to ensure that we can do underfill if we deem it necessary du
Electronics Forum | Wed Oct 25 10:33:08 EDT 2000 | Chris
I need to know the advantages or disavantages of a plastic or FR4/Flex based BGA over the ceramic based BGA. We have a BGA package we are going to have produced. Some want to have it made out of ceramic because they feel a ceramic package will be a
Electronics Forum | Thu May 06 08:59:25 EDT 2004 | davef
Even with PbSn solderpaste the leadfree BGA's have a superior resistance to solder-joint fatigue failure when compared to conventional parts. [Solder Fatigue Reliability Issues in Lead Free BGA Packages, Pedro Chalco of IBM, Pan Pacific Microelectron
Electronics Forum | Fri Sep 21 16:00:55 EDT 2001 | davef
In addition to providing guidelines for BGA inspection and repair, IPC-7095 also addresses reliability issues associated with BGA: 7095, �Design and Assembly Process Implementation for BGA's� Your boards should be assembled in conformance with: *
Electronics Forum | Fri Sep 11 00:52:19 EDT 1998 | Rick Thompson
| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re
Electronics Forum | Sat Feb 19 09:11:36 EST 2005 | davef
Currently, we see lead-free solderballs on BGA. The issue for us is determining the reliability of these components when using leaded solder. Most solder materials manufacturers supply lead-free solder balls. Check with your current solder paste s
Electronics Forum | Wed Jan 19 05:22:20 EST 2000 | Neil Stoddart
Help! I need to know what is the most cost effective and reliable method of storing BGA's at trackside, once they have been removed from their dry pack? The method of storage needs to keep the components below 20% RH, at room temperature without the
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