Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel
I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false
Electronics Forum | Tue Mar 14 05:02:35 EST 2000 | emmanuel
I am to implement PBGA, and i am looking for PCB surface finish informations. A lot of technical reports are specifing NiAu finishing because of flatness property. Because of leads shape, I though that BGA doesn't need flat pads like QFP. Is it false
Electronics Forum | Mon Jun 26 08:54:35 EDT 2006 | dougs
We have a new product in where a 0.7mm pitch uBGA is to be placed on a 2 layer flexi board. Also a 20thou pitch connector. Has anyone done anything like this before, what should i look out for. Not done much flexi work before so any tips will be g
Electronics Forum | Tue Jul 11 10:13:22 EDT 2006 | SWAG
Over time, you might see problems with delam., blistering and warpage if using FR4 carriers. Depending on volumes, you might consider using durostone or some robust material like that for the production runs. Keep in mind that switching materials w
Electronics Forum | Sat Jul 29 09:10:16 EDT 2006 | davef
Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board placed in an array on the bottom of the package. They are attached to the board with tiny balls of solder placed on each contact. Pin Grid Array (P
Electronics Forum | Sun Mar 01 15:52:13 EST 1998 | Earl Moon
| From several months I am investigation about the VOIDS PERSENCE and his important as reliability. | One question now is : | It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? | I
Electronics Forum | Thu Mar 13 01:42:58 EDT 2008 | Sean
Thanks Real Chunks and Davef...Yours input is valuable to me. My inputs towards your question asked below: Questions are: * Why did you tell us the following? "This BGA is installed with heatsink (with hook at both side of the heat sink) manually b
Electronics Forum | Tue May 28 13:46:27 EDT 2002 | Yannick
Hi, I know that this topic have been discuss before but I would like to know what kind of equipement do you use to check your BGA and to rework it? What should I look for before buying something. Some people said that is not a good thing to
Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef
You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the
Electronics Forum | Mon Apr 02 17:16:22 EDT 2001 | kward
Try IPC-7095. It is not free , but discusses in-depth Design and Assembly Process implementation for BGAs. Website is ipc.org
.gif)
winsouce.jpg)