New Equipment | Assembly Services
TI New and Original UCC28C43DGK in Stock IC MSOP8 , 22+ package UCC28C43DGK -40°C to 105°C Operating Temperature, 20V, 1A, Low Power 1MHz Current Mode PWM Controller with 8.4V/7.6V UVLO 100% Duty Cycle XC6SLX150-3FGG484C BGA XILINX 20+ XC6S
New Equipment | Assembly Services
TI New and Original TPS92624QPWPRQ1 in Stock IC HTSSOP20 ,21+ package TPS92624QPWPRQ1 Automotive Quad High-Side LED Driver with Heat Sharing XC6SLX150-3FGG484C BGA XILINX 20+ XC6SLX100-3FGG484C BGA XILINX 14+ XC6SLX25-2FTG256C
New Equipment | Assembly Services
ON New and Original FGA30S120P in Stock IC TO-3PN , 21+ package FGA30S120P IGBT, 1300V, 30A, Shorted-anode XC6SLX150-3FGG484C BGA XILINX 20+ XC6SLX100-3FGG484C BGA XILINX 14+ XC6SLX25-2FTG256C BGA XILINX 21+ XC6SLX45-2CSG32
New Equipment | Assembly Services
ST New and Original M27C2001-10F1 in Stock IC FDIP-32W , 21+ package M27C2001-10F1 2 Mbit (256Kb x 8) UV EPROM and OTP EPROM XC6SLX150-3FGG484C BGA XILINX 20+ XC6SLX100-3FGG484C BGA XILINX 14+ XC6SLX25-2FTG256C BGA XILINX 2
New Equipment | Assembly Services
TE Connectivity New and Original MS25036-102 in Stock IC Terminal , 21+ package MS25036-102 Terminal PIDG 22-16 XC6SLX150-3FGG484C BGA XILINX 20+ XC6SLX100-3FGG484C BGA XILINX 14+ XC6SLX25-2FTG256C BGA XILINX 21+ XC6SLX45-2
New Equipment | Assembly Services
Broadcom / Avago New and Original ACPL-P349-560E in Stock IC Reel 21+ package ACPL-P349-560E Logic Output Optocoupler Gate Drv Optocoupler T/R VDE LF MC78M05ABDTRKG TO252-3 ON 18+ NCV7321D12R2G SOP8 ON 21+ TPS92663AQPWPRQ1 HTSSOP24 TI 21+ EP
Industry News | 2007-10-30 01:07:14.0
LOS ALAMITOS, CA � October 30, 2007 � Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will showcase its latest technology in representative AAT Aston GmbH�s booth in Halle A4/Stand 480 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.
SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a
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New Equipment | Assembly Services
JST New and Original BM04B-GHS-TBT(LF)(SN)(N) in Stock IC Automotive Connectors package BM04B-GHS-TBT(LF)(SN)(N) Wire-to-Board (Crimp style) PEX8725-CA80BCG PLX BGA BROADCOM/PLX 20+ IPJ-P6005-X2AT QFN IMPINJ, INC. 21+ STM32H750VBT6 LPFP100 ST
EP3C25F324I7N ALTERA BGA in stock new and original EP3C25F324I7N ALTERA BGA in stock new and original Our advantage product have infineon, DIODES, IR, ST, TI, ADI, Microchip, NXP, XILINX, LINEAR, Atmel, CYPRESS, JST, Maxim, VISHAY, FUJITSU, TOSHI
