Electronics Forum | Fri Oct 29 09:06:52 EDT 2004 | Rob
Hi Paddy, There's been a lot of low cost second user underfill equipment around recently, I've seen stuff go for as low as �20K - but make sure a dispense head is included. Good luck, Rob.
Electronics Forum | Tue Jan 31 13:55:56 EST 2006 | samir
Anyone know what the general rules / requirements are for micro-BGA's and CSP's as to when capillary underfill is required? (ie size of bump/ball, package thickness, PCB/CSP thickness ratios, etc).
Electronics Forum | Tue Jun 11 14:53:06 EDT 2013 | emeto
I am not sure that underfill and rework can get along. these boards might be scrap already. You need to get more information about the underfill(manufacturer, supplier...)
Electronics Forum | Wed Sep 09 10:37:40 EDT 2020 | SMTA-64386317
Hi, Anybody knew what is appropriate bump height for BGA that will be ideal for underfill process. The undefill must be strong enough to hold the component.
Electronics Forum | Thu Aug 23 21:36:49 EDT 2001 | morefun
Thanks Dave - I am overwhelmed and appreciative of all the posts that you reply to, it is amazing!!!
Electronics Forum | Fri Oct 29 09:34:48 EDT 2004 | glaucon
See attached link, I've used this in the past. http://www.efd-inc.com/
Electronics Forum | Mon Jan 17 13:14:48 EST 2005 | GS
Please, can you advice me on the subject. Thanks a lot GS
Electronics Forum | Tue Jan 18 11:18:13 EST 2005 | GS
Thanks Dave, I'll come back. Regards GS
Electronics Forum | Thu Jun 27 16:09:02 EDT 2013 | burstd
try yincae's SMT 158 capillary underfill. very easy reworking
