Electronics Forum | Tue Mar 09 17:41:24 EST 2004 | davef
Try this: * Run the board through your reflow oven set for a "normal" recipe, but with the cooling section turned off. * Pick the BGA from the board while the solder is still liquid using tweezers [or similar tool].
Electronics Forum | Fri Mar 19 10:06:22 EDT 2010 | karlo
Rework is typically done by heating the BGA to 170-180C to first scrape off the fillet. Then, heat to above reflow, and lift the BGA. Then, collapse the solder with heat and flux. Then, back down at 170-180C, scrape off the underfill from the boar
Electronics Forum | Wed Mar 17 19:57:08 EST 2004 | Dreamsniper
Do you wanna save the BGA or what? Do you have an electric stove, baking tray and a BBQ clip? Does your wife love cooking? if u have one of each, then u don't need a reflow oven which is too expensive and you don't need to buy heating guns or drill p
Electronics Forum | Thu Feb 22 05:32:32 EST 2007 | lococost
Those guys didnt suggest you get in there and check did they Mr Wavemaster?
Electronics Forum | Mon Feb 12 13:58:10 EST 2007 | campos
Tks for the answers,, My concern is about the intermetalic layer,,I run SMQ230 LEAD FREE paste.. its liquidous at 217C..the oven have 7 zone, but I run in 5 zones also with a more agressive profile (due to the line rate)..I would like to know if runn
Electronics Forum | Mon Feb 12 13:01:09 EST 2007 | campos
Hi all,, I running SMQ230 solder paste with a time above = 40sec with peak temperature = 239 degrees .. the complete reflow takes almost 6 min with a slope (150to190) close to .60 degrees/sec .. may I have some concern about that or it's ok?? tks..
Electronics Forum | Mon Feb 12 13:15:14 EST 2007 | realchunks
Does this meet the SMQ230 recommended time above liquidous? Do you have any parts that cannot withstand 239 degress C? If meet SMQ230's recommended time and temps and your parts are rated for this temp, then you should be OK. The real proof is ref
Electronics Forum | Mon Feb 12 17:24:51 EST 2007 | dave
250-260ish seems a little on the high side ? Depending on the board density and components 230-245 should suffice. Again time above is usually preferred between 30-90secs but again it really depends on the PCB Dave
Electronics Forum | Wed Feb 21 15:29:34 EST 2007 | wavemasterlarry
I here alot of guys at my place talking about cold spots in the oven. You may want to check for them in yours.
Electronics Forum | Fri Feb 16 13:43:07 EST 2007 | ck_the_flip
Hi Darby, Where did you get the info. that cooling rate is not-as-critical for lead-free? I'm not doubting you, and I actually want this to be the case. We don't have chillers on our ovens, and on fast profiles, we only achieve 2 to 2.5 deg. / s c
