Electronics Forum | Thu May 06 18:48:22 EDT 2004 | Dreamsniper
SUMMIT 750. My yield is 75%-98%. And they all depend on the pad design, stencil, paste, operator, thermal profile, etc. I have 98% yield on some of our products with good pad design. Process is easy to control. Dreamy
Electronics Forum | Fri Mar 30 09:23:22 EDT 2007 | JD
I agree completly. When the techs in the factory bring boards to me for the PCB operators to replace BGAs on I ask lots of questions before releasing it to PCB dept. Many times its a guess on the techs part because they are frusterated with troublesh
Electronics Forum | Fri Mar 30 14:47:27 EDT 2007 | GS
MSL 3) By SAM (Scanning Acoustic Microscope) before to remove them from PCB, you could identify if de-laminated or not and the degree of delamination. Best Regards...GS
Electronics Forum | Fri Nov 09 16:57:27 EST 2001 | davef
Sure, it�s fine to use the proper amount of flux and no solder when reworking BGA. Recognize that these new solder connections have less metal and a lower standoff than similar BGA solder connections that have not been reworked. This undoubtedly
Electronics Forum | Thu Mar 29 09:15:42 EDT 2007 | chrissieneale
Humm OK - sort of what i thought - So 90% of the time it's something else - but I assume that if you say that you are fairly confindent that you have a robus process around BGAs - where as i do not. Can we assume that it is actually the BGAs (as so
Electronics Forum | Fri Mar 12 12:59:50 EST 2004 | babe
Sorry for the late reply, I am an ersa dealer may I suggest mounting an alternative thermocouple attached to a DMM in close proximity to the BGA. See what the differences are in your readings from the DMM and the Digital temp reading on the IR550A. I
Electronics Forum | Tue Mar 20 06:47:56 EDT 2007 | realchunks
I agree with CL. Most people blame the BGA cause it's a mystery chip to most people. Only after replacing the BGA several times do most people look else where. 90% of the time it's something else. Doing all your engineering work up front is the
Electronics Forum | Mon Aug 08 06:17:09 EDT 2005 | Hi Steven
My suggest is using Ersa IR55A or IR650A. http://www.ersa.de/en/ If you looking for your quality, you need this system. I had try it many time, is better then hot air. and you can set the profile as you like, even Flat Peak on the Lead Free Rework.
Electronics Forum | Mon Mar 16 16:58:51 EDT 2009 | Charlie D
We evaluated several rework machines a few years ago and decided on the Finetech CRS-10. It outperformed the Airvac DRS25 machine. We didn't bring in the Focal Spot because it uses IR. The Focal Spot System does not have a solder removal option and
Electronics Forum | Tue Mar 20 03:21:32 EST 2001 | hany_khoga
Dear Mr. Stephen: After all boards we lost & hard time we had, the only convencing solution for us is to run a good pc_motherboard (which is our product)to confirm the experiment. After that we need to remove the big BGA ,clean & flux the PCB then s
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