Electronics Forum | Thu Sep 12 11:26:11 EDT 2002 | scottefiske
CK, If joints have been validated prior to ICT (under BGA Scope), more often than not repeatable joint fractures are due to undo stress being placed on the component during ICT test. Verify ICT probes and fixture. If after proving out fixture/pin com
Electronics Forum | Thu Sep 12 01:49:28 EDT 2002 | ck
Hi all, Any stencil opening recommendation for 20mils pitch mirco BGA. Currently, using 12mils round opening, 5 mils thickness. Seen to have weak joints as it crack after Ict testing. thks
Electronics Forum | Tue Mar 09 17:41:24 EST 2004 | davef
Try this: * Run the board through your reflow oven set for a "normal" recipe, but with the cooling section turned off. * Pick the BGA from the board while the solder is still liquid using tweezers [or similar tool].
Electronics Forum | Fri Mar 19 10:06:22 EDT 2010 | karlo
Rework is typically done by heating the BGA to 170-180C to first scrape off the fillet. Then, heat to above reflow, and lift the BGA. Then, collapse the solder with heat and flux. Then, back down at 170-180C, scrape off the underfill from the boar
Electronics Forum | Thu Sep 12 09:15:29 EDT 2002 | mhoughton
I have printed and placed similar devices in high volume with exactly this spec for a couple of years with no problems, are you using laser cut stencils and what type of solder paste are you using? and what is the end use of the product as it may nee
Electronics Forum | Thu Sep 12 09:12:22 EDT 2002 | mhoughton
I have printed and placed similar devices in high volume with exactly this spec for a couple of years with no problems, are you using laser cut stencils and what type of solder paste are you using? and what is the end use of the product as it may nee
Electronics Forum | Wed Jan 15 21:55:41 EST 2014 | padawanlinuxero
we do that and there's a variation on the solder temp. sometimes around 10 degrees, we have 2 solder pallets that are run in intervals of roughly 3 1/2 minutes a part (the time that take the operator to put all 3 terminals in a 42 pcbs per board, and
Electronics Forum | Thu Jan 09 19:55:14 EST 2014 | padawanlinuxero
Hello! I have a problem with one of the products here, we use a pallet to run the board on the solder wave, when the board gets solder and you inspect the board you notice that for some reason the first pcbs that touches the wave are ok, even a litt
Electronics Forum | Fri Jan 10 11:36:03 EST 2014 | rgduval
One thing you could check/monitor is the temperature in the pot/wave. As boards run across the wave, they will cause fluctuations in the wave temperature. The heaters should hep with minimizing this; but, if you're running a lot of boards in quick
Electronics Forum | Mon Jan 13 18:21:54 EST 2014 | vwhipple
A little confusion here. Are you running several boards in one pallet and the last boards are looking poor or is the issue getting worse as the day progresses (like as the pallets get warm)? - If it is the last boards in the pallet, then you may wan
