Electronics Forum | Wed Mar 17 19:41:15 EST 2004 | Dreamsniper
I'm hit with the above problem and found out that the BGA's themselves have fibres on their solder balls. I have soldered some without having the knowledge of the above fibres and found that the fibres are caught between the PCB pad and the BGA solde
Electronics Forum | Mon Jun 02 19:41:41 EDT 2008 | operator
Is there some good resources (.pdfs, websites, articles) that someone can point me to regarding design for bga footprints? I need to brush up on thermal relief design for bga footprints. I got a customer whose bga lands are masking defined on top of
Electronics Forum | Mon Aug 09 17:02:32 EDT 2004 | arminski
Hi Shean, Thanks for the analysis. "Your product looks like it may have non-solder-mask-defined pads." Yes. It is a NSMD PCB. "Does there appear to be any residues on the bare boards, and/or, BGA components prior to applying the solder paste?"
Electronics Forum | Mon May 10 16:37:01 EDT 2004 | davef
First some definitions, the two main types for solder masking near BGA pads are: 1 Pad, Non-Solder Mask Defined. In circuit board design, pads with spacing that does not allow solder (usually bumps) on the pads to contact the adjacent solder mask. [
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
Electronics Forum | Mon Aug 31 22:30:09 EDT 1998 | Kelly Morris
We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. Our pad design is .020" diameter pads with .025" solder resist diameter. The center
Electronics Forum | Tue Sep 01 19:16:51 EDT 1998 | Kallol Chakraborty
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
Electronics Forum | Fri Sep 07 11:46:29 EDT 2018 | dleeper
Air gap on the PCB is determined the pad spacing which in turn is governed by the component. As long as the PCB designer is following the typical BGA layout best practices; i.e no open via in pad, non-solder mask defined pads, solder mask covered tra
Electronics Forum | Wed Jul 09 16:01:10 EDT 2003 | russ
Mike, the one pad that is "small" definitely appears to be over etching (It looks like it was supposed to be much larger). What is the dims of this little bugger as compared to the Gerber? i would also tend to believe that there probably is some mask
