Electronics Forum | Fri Nov 22 13:12:07 EST 2002 | bcceng
Maxtim, the rework stations you mentioned are the lower end low cost units, all great machines. Now days you can get a real deal in the used market on the top of the line models offered in rework stations. There are three rework station that I consid
Electronics Forum | Thu Jul 17 04:42:47 EDT 2003 | sanjeevc
Hi! One technique: 1. Remove all balls 2.Make > a mask(stensil)for reballing.The holes of the > mask must be 0.8-0.9 the size of the pads. 3. > Reball chips 4. Reflow chips Good luck Hi Yes,we have done quite a bit of reballing of BGAs with
Electronics Forum | Mon Jun 19 13:56:36 EDT 2000 | Dave White
Hello... Oh Yes.. the fine art of rework. There is not a comprehensive textbook or manual that covers every conceivable situation. Just practical guidelines. I suppose the next step is to isolate probelm areas and discuss solutions in more specifi
Electronics Forum | Wed Feb 14 16:03:54 EST 2001 | lileubie
Do you have a stencil wipe step after every six boards? If so, the wipe either automatic or manual needs to be optimized. Either less solvent or more time for the solvent to evaporate off.
Electronics Forum | Tue Jan 13 22:07:42 EST 2004 | davef
No, there is no such information. Choices are: * Recognize that any voiding is a process indicator and that when observed, indicate a requirement for taking corrective steps. * Tell your quality people to quit looking at components other than BGA wi
Electronics Forum | Wed May 02 07:47:21 EDT 2007 | Bob R.
Don't dink with the profile until you have evidence that the profile has something to do with the problem. Step 1 is a cross-section. Where are the joints breaking? Do the joints show signs of proper wetting & intermetallic formation?
Electronics Forum | Tue Nov 10 07:35:04 EST 2009 | scottp
Step 1 is to find out what kind of opens you're getting through a cross-section or die & pry. Are they head in pillow, brittle fracture at the intermetallic, bulk solder cracks, ball separation from interposer? Without some basic failure analysis a
Electronics Forum | Thu Nov 05 20:53:37 EST 2015 | shuttlestar
It's a strange task . if your PCB is very very small ,using topside heat is not a big problem . but for a whole PCB board . if delete the step of preheat, it will broke the whole PCB . BTW,do you finish your task ?
Electronics Forum | Tue Aug 20 21:39:29 EDT 2019 | sssamw
6 mil (0.15mm) for the 1.13mm pitch BGA, and 4 mil (0.1mm) for the smal QFN with 0.4mm pitch.
Electronics Forum | Thu May 17 09:53:14 EDT 2007 | mohdfazuwan
For ur information, this BGA machine was full utilize every day. I have more than 100 model to do profiling every week. Different PCBA with different thickness & material need different temp setting. currently i'm looking for profiler that more compa
