Electronics Forum | Thu Nov 05 03:40:34 EST 2009 | valeo
Hi Rajeshmara, Mail sent with the datasheet of the glue we use in production. Thanks for first information you provide me for the shear specifications on 1206. But can you be more precise on this point ? How did you define it ? Is anyone have more
Electronics Forum | Wed Feb 01 11:33:37 EST 2017 | emeto
Joshua, 100um is 4mil aperture. You should ask several stencil houses about the possibility to print that small amount of paste(type 6 paste is available now with very small solder spheres 5-15um diameter). Even applying small amount(thin layer of f
Electronics Forum | Wed Oct 04 00:47:57 EDT 2017 | silversurfer11
Hello, I am experiencing a high pitched noise coming from a computer component and I think it might be the 18 inductors they have placed on the PCB as part of the VRM. I am think of using a 2 part Thermal Conductive Adhesive and fix all the inducto
Electronics Forum | Tue Oct 30 22:08:45 EST 2001 | flynhi34
I have not looked into eutectic die attach. My dies are about .012" square and could get smaller. Currently using a Epoxytech conductive adhesive. I am going to go out and look at equipment and build samples. Some vendores state they can do .010"
Electronics Forum | Mon Dec 07 09:22:50 EST 1998 | rick
| Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. | Any in
Electronics Forum | Fri Jun 01 06:40:39 EDT 2012 | umar
Hi Norman... Thansk on yoru input, actually my adhesion test conduct is after pass of IC test. MY IC Test is shown a good result but when go into teh Test adhesion coating then during peel off test my board was failed.
Electronics Forum | Tue May 25 10:56:12 EDT 1999 | John Thorup
| | | Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the bo
Electronics Forum | Mon May 24 10:17:54 EDT 1999 | john thorup
| Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the board
Electronics Forum | Tue Jan 09 22:04:48 EST 2007 | Guest
Set Up Guy, I am not sure if the COB you are refering to means Circuit on Board . If yes, this process also include SMT . Package is a combination of some passive components and bare die. Passives are normally attached thru SMT using solder te
Electronics Forum | Mon May 24 17:17:21 EDT 1999 | JohnW
| | Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the boar
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