Full Site - : contamination on immersion gold (Page 7 of 14)

Re: Solder on GF

Electronics Forum | Wed Jul 14 10:58:25 EDT 1999 | Upinder Singh

| | Hi All, | | Does any one experienced the solder on gold finger after | | reflow. Its about 5 to 8 mils diameter . | | We'd clean the entire screen printer, mounter & reflow as well, | | but doesn't help much. | | | | | Mr Kong..... | | Solder

Solder Spotting on Gold

Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis

This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder

Re: Solder on GF

Electronics Forum | Wed Jul 14 11:36:56 EDT 1999 | Jimmy Strain

| | | Hi All, | | | Does any one experienced the solder on gold finger after | | | reflow. Its about 5 to 8 mils diameter . | | | We'd clean the entire screen printer, mounter & reflow as well, | | | but doesn't help much. | | | | | | | | Mr Kong..

Re: Solderability on Immersion Gold

Electronics Forum | Tue Feb 29 14:10:09 EST 2000 | Glenn Robertson

Steve - I believe you should ask who has NOT dealt with this before. Search the archives for "dark pad" or "black pad". It's a common problem for immersion Gold. Does anyone Know any other descriptive names that I missed (and can be printed

Re: Solderability on Immersion Gold

Electronics Forum | Tue Feb 29 14:10:09 EST 2000 | Glenn Robertson

Steve - I believe you should ask who has NOT dealt with this before. Search the archives for "dark pad" or "black pad". It's a common problem for immersion Gold. Does anyone Know any other descriptive names that I missed (and can be printed

Gold Surface Finish on PCB's

Electronics Forum | Thu Dec 08 08:29:25 EST 2005 | davef

Grant The solution to soldering problems with immersion gold boards is: find a supplier that can control his/her process. Electroplated gold over nickel is a very reasonable process. Billions of wire bound boards use it evry year.

Tented vias on ENIG boards

Electronics Forum | Mon Feb 06 10:02:14 EST 2006 | Yash Sutariya

Sorry. I actually should clarify those slides. Black pad is not associated with tented vias. Also, you can tent vias with soldermask, but this requires the immersion gold process to be completed prior to soldermask. As such, all copper features (

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 07:40:46 EST 2000 | Roni Haviv

Allmost forgot: The "black pad" is simply the oxidized Nickel.

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 07:40:46 EST 2000 | Roni Haviv

Allmost forgot: The "black pad" is simply the oxidized Nickel.

Gold Surface Finish on PCB's

Electronics Forum | Wed Dec 14 07:34:33 EST 2005 | davef

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