industry follows new trends in a blink of an eye. N
Optimizing Flip Chip Substrate Layout for Assembly Optimizing Flip Chip Substrate Layout for Assembly High-density flip chip applications are commonly limited by the available substrate technologies. Accordingly, considerable design efforts
SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Articles Bare PCBs Printed Circuit Board Fabrication Basics - An Outline by Earl Moon - Proof Of Design (POD) The Laboratory - A Primary