Industry News | 2009-04-15 23:01:13.0
BANNOCKBURN, Ill., USA, April 2, 2009 � IPC � IPC � Association Connecting Electronics Industries� has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO, held March 31�April 2, 2009 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
Industry News | 2010-04-10 02:16:34.0
IPC has released the E revision of IPC-A-610, Acceptability of Electronic Assemblies. IPC's most widely-used standard, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements, now addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations.
Industry News | 2010-04-10 02:22:08.0
Helping electronics manufacturing companies better manage the growing documentation required to ensure products comply with evolving environmental regulations, IPC — Association Connecting Electronics Industries® has released IPC-1752A, Materials Declaration Management. The A revision of the standard provides an updated and expanded industry-wide reporting format for material declaration data exchange between companies in the electronic interconnect supply chain.
Industry News | 2010-04-10 02:45:03.0
IPC – Association Connecting Electronics Industries® has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO™, held April 6–8, 2010 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
Industry News | 2010-08-25 14:54:48.0
Industry experts will shine the spotlight on recent revisions to key electronics manufacturing industry standards and guidelines during IPC’s professional development program at Electronics Midwest. On September 27 and September 29–30, half-day, in-depth workshops will address major updates to the standards that establish electronics manufacturing requirements and acceptability criteria worldwide. In addition, a workshop covering industry best practices, new and emerging developments and future trends in materials and processes for packaging and assembly will be offered.
Industry News | 2010-09-22 15:01:40.0
Removing heat has become a major issue in the electronics industry as more highly integrated devices are jammed into less space and as high power devices, such as LEDs, become increasingly more common.
Industry News | 2010-10-07 14:26:23.0
Yielding to growing concerns regarding the EU Parliament’s proposal to list thirty-seven substances for priority assessment under a revised RoHS Directive, the Belgian presidency proposed to abandon inclusion of a list of priority substances. Belgium currently holds the rotating EU Presidency and is responsible for chairing the EU Council.
Industry News | 2011-03-31 11:54:23.0
Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.
Industry News | 2011-07-06 08:56:07.0
The revised European Union (EU) Restriction of Hazardous Substances (RoHS) Directive was published today in the EU Official Journal. The Directive is expected to go into effect on July 21, 2011, twenty days after publication. Member States will have 18 months to transpose the Directive into national law. Member States’ regulations are expected to take force no later than January 2, 2013.
Industry News | 2011-10-16 00:27:12.0
With all votes tallied from the special IPC APEX EXPO® keynote speaker election, William Shatner has emerged the clear winner, taking the popular vote by a considerable margin over the other candidates.
