Electronics Forum: custom x-ray (Page 7 of 11)

Counterfit parts

Electronics Forum | Thu Feb 16 12:16:57 EST 2012 | swarnergictg

No-one should be accepting parts based solely on the presence of a C of C - from an independent or even an authorized distributor. You should have a QC plan in place that includes comprehensive visual inspection, microscope, x-ray, XRF, decapsulation

Re: Suspect BGAs

Electronics Forum | Wed Mar 17 19:00:14 EST 1999 | Earl Moon

| | | We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot o

Re: Why does everyone want to x-ray BGA?

Electronics Forum | Fri Apr 17 14:03:48 EDT 1998 | Earl Moon

| Hello Ya'll, | I've got what may be a silly question, but why does it seem so important to everybody that you have x-ray capability if you're thinking about doing BGA? | I know what most people will tell me; "Steve, that's a pretty silly qu

Re: BGA's - Re-ball -- How thick?

Electronics Forum | Tue May 18 16:48:49 EDT 1999 | Tony

| | | | | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | | | | | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard mi

Re: Solder ball bridging under BGA

Electronics Forum | Wed Sep 02 08:44:50 EDT 1998 | Kelly Morris

| Hi, | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it.

Voids in solder fillet

Electronics Forum | Wed Apr 16 13:19:13 EDT 2003 | Takfire

Thanks Russ! The origianal complaint from the customer was in regards to what appeared as "bumpy" appearance and "holes" in the solder fillet. This problem was originally presented as an appearance issue only. Further investigation by our DPA lab r

Faults Associated with Pumice Scrub

Electronics Forum | Thu Apr 15 11:14:34 EDT 2004 | mikecollier

Our conformal coat area has recently requested changes to our bare board houses to perform a pumice scrub operation on the PWB prior to HASL plating and delivery to us. Our first lot received caused us to have void faults under multiple component ty

MC33982PNAR2 (aka PC33982BPNAR2) PQFN

Electronics Forum | Fri Oct 20 11:23:33 EDT 2006 | mmjm_1099

Good morning/afternoon/evening everyone! I am seeking the assistance/guidance of anyone who has had practical experience with placing, soldering, and rework of this particular component. One of our customers is looking to use this component on quit

How to Differentiate Class 3 and Class 2 products in terms of process

Electronics Forum | Mon Jan 12 21:31:26 EST 2015 | warwolf

The closer your inspection the more defects you will find, the more rework you do the possible cost you will add and the potential increase of damage you could do to your products if rework is not up to a machine copyable standard. "Is there any in

BGA Reliability

Electronics Forum | Wed Jul 24 23:21:26 EDT 2002 | ppcbs

Being in the line of BGA rework and having performed much rework on boards that go into military planes, I can give you an opinion from a practical background rather than an in depth study. Basically BGA's have caused many of my customers big headac


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