Electronics Forum | Wed Jan 09 21:19:49 EST 2002 | davef
When I said "In this area, there is no difference between your experience in ceramic substrates and PTFE substrates." I was referring to the area we were discussing ... gold plating. I am sorry if you thought I ment than the wire bonding process wa
Electronics Forum | Wed Sep 11 07:23:07 EDT 2002 | johnw
peter, define what you class as SPC for these area's, or do you just mean looking at the PPM or DPM levels? John
Electronics Forum | Fri Sep 21 10:33:56 EDT 2007 | russ
we use welders gloves with cuffs. there are some other heat gloves out there as well, we like the durability of leather though Russ
Electronics Forum | Thu Jul 20 16:15:24 EDT 2000 | Bob Willis
Sorry at the moment I do not have information but as usual I want to get some hands on sessions going. We were doing a flip chip workshop hands on session for Speedline last week in England. We did the theory and then hands on soldering and underfill
Electronics Forum | Tue Dec 03 18:31:45 EST 2002 | slthomas
At the price of Durapol we'd never get the OK to have them made. The Al fixtures are cheap and a quick turn local item. As dense as the pth parts are I also don't think there'd be any room for any holes which I really think is the answer as far a
Electronics Forum | Wed Sep 11 12:52:14 EDT 2002 | slthomas
We have found that using the SPC capability of the profiler's pc software helps us identify oven malfunctions sooner than we would normally find it. The ovens tend to compensate for dieing or dead blowers by cranking the heaters on for longer cycles
Electronics Forum | Wed Jan 09 17:14:48 EST 2002 | mregalia
Do you bond with Al or gold wire? What happens if the Ni is over 150 microinches? Thickness of nickel is one those things that we have not been consistent with. The industry seems to pretty much universally call for 100-200 microinches. Our old board
Electronics Forum | Wed Jan 09 18:17:15 EST 2002 | Chris
I don't have a plasma cleaner either. It will help a lot. Actually I don't clean at all. Our wirebond pads are far enough away so the flux residue does not get on the wirebond pads. That's what we think anyway. I am sure we have some degree of c
Electronics Forum | Wed Jan 09 12:20:00 EST 2002 | mregalia
Thanks for cluing me into IPC-2221. Though the numbers they give seem to contradict what I have learned from people working with the materials. At least I now know where the guideline for a max of 30 microinches of gold for soldering comes from. But
Electronics Forum | Wed Jan 09 15:24:49 EST 2002 | mregalia
Thanks Chris. As I was writing my last message our mailperson dropped off the latest issue of Circuit Assembly. It has an article on mixing SMT and COB on the same board. The author recommends as a compromise 10-20 micro inches of gold over 70-100 of
