Full Site - : davef solder (Page 7 of 73)

does copper wire become thinner when it dip to leadfree solder?

Electronics Forum | Thu Nov 03 04:31:21 EST 2005 | arnold

davef, how can you convince me that 100Sn dissolved copper much faster?

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Wed Aug 27 00:20:38 EDT 2008 | rameshr

Dear davef, Will u pls advice what are all the possible defects caused while soldering ( assembling ) this type of boards.

Question of delamination in PCB

Electronics Forum | Sat May 02 23:31:06 EDT 2009 | kareal

Thanks davef. The defect always occurred during UHAST reliability, but not find in reflow. The key is that there is tin diffuse to copper trace under solder mask. is it a "normal" board defect and what is the potential risk for device? thanks!

Question of delamination in PCB

Electronics Forum | Fri May 08 04:39:32 EDT 2009 | kareal

Hi Davef, I want to explain that the tin diffusion in my project is not on solder bump/Pad region. It is on copper trace between bumps. so it is very wondering for me.

Pin in Paste of screw terminals

Electronics Forum | Wed Aug 26 20:58:52 EDT 2009 | mika

Hi, Just as DaveF said; please give us some more information. It could be a a´lot of things. For .ex. Do you by any chances solder with Ni/Au at the board?

Importance of Exposed Pad In ST QFP for Set top box product

Electronics Forum | Fri Oct 30 08:24:12 EDT 2009 | rajeshwara

thnx davef & all With the help of all at last i solved the problem , The vias are not caped from bottom , so solder paste draining through the via to the floor which creates voids between IC ground pad and e-pad. Tnhx all again

Nickel Silver Reflow Process - Specifics

Electronics Forum | Fri Feb 15 14:45:30 EST 2013 | davef

Yes, the standard applies to things that are soldered. Read this ipc.org/TOC/J-STD-002C.pdf BR, davef

Tin Oxide on Solder Joints

Electronics Forum | Mon Jul 01 15:40:12 EDT 2013 | davef

Walter: The things I'd look at first are: * Temperature of the water wash. I expect the solution to be in the 140-150*F range [Check with your flux supplier for recommended temperatures] * Temperature of the boards when entering the cleaning process.

Minimum Component Spacing with Minimum Solder Mask Width of 4mils

Electronics Forum | Mon May 19 15:13:05 EDT 2014 | davef

Consider this combination: * IPC-7351B - Generic Requirements for Surface Mount Design and Land Pattern Standard * IPC Tools & Calculators [ipc.org/contentpage.aspx?pageid=PCB-Tools-and-Calculators ] * Component fabricator suggestions BR ... davef

Thiourea exposure in manual soldering of immersion tin PCBs

Electronics Forum | Mon Jun 02 20:38:42 EDT 2014 | davef

I believe that you get better responses when you start a new thread, but that's just an opinion, not a rule. BR ... davef


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